ECS Details first AMD’s Llano Fusion Motherboards Featuring FM1 Socket

Hassan Mujtaba

Elitegroup Computer Systems (ECS) has announced the first details of its upcoming FM1 Socket based Motherboards which will support AMD's A-Series APU (Accelerated Processing Units). ECS is manufacturing three motherboards for the upcoming A-Series Llano Processors which consist of ECS Black Deluxe A75F-A, and ECS mainstream series A75F-M and A75F-M2 motherboards, An A-Series APU codenamed "A8-3530MX" has already been detailed which you can view here.

 

All motherboards feature support for the latest AMD A-Series APU with AMD Hudson D3 chipset and AMD FM-1 socket. ECS Black Deluxe A75F-A is an ATX board which consists of 1 PCI-e x16 slots, 4 x DDR3 Dimm slots while connectivity ports include 4 USB 3.0, 5 Sata 6.0Gb/s and 8 Channel Audio port. The board features high quality durability as it passed through a 50C torture test. Display ports include HDMI/DVI/D-Sub.

The ECS A75F-M and A75F-M2 motherboards are Micro-ATX Form Factor boards with M consisting of 4 DDR3 slots while M2 consists of only two. Both boards include single PCI-e x 16 slots, Connectivity ports of 4 USB 3.0 and 6 Sata 6.0GBps are included too. The M variant comes with a 8 Way Audio port, M2 comes with 6 way audio port. Display connectivity remains same which includes HDMI/DVI/D-Sub.

All motherboards would come with DX11 and UDV3 Graphics which would be embedded on the APU itself. These will consist of a Radeon HD 66** series Graphics chipset with Turbo Core feature to allow for auto boost in the core clock. Other features include EZ Charger/eDLU/eBLU/MIB III and anti-static (ESD) protect for the ease of usage.

A couple of new AMD Llano Fusion chips have already been detailed which you can view here.

Source

Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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