Cooler Master’s V8 3DVC Heatsink Cooler Comes With Vapor Chamber For Up To 300W CPU Cooling, G11 360mm AIO Also Showcased

Jan 5, 2024 at 04:30am EST
Cooler Master's V8 3DVC Heatsink Cooler Comes With Vapor Chamber For Up To 300W CPU Cooling, G11 360mm AIO Also Showcased 1

Cooler Master has unveiled two next-gen CPU coolers, the V8 3DVC & the G11 AIO, both offering high-end cooling of up to 300W.

Cooler Master Showcases Innovative CPU Coolers In Heatsink "V8 3DVC" & AIO "G11 360" Designs, Up To 300W Thermal Dissipation Power

The Cooler Master V8 3DVC continues to build upon the legacy of the iconic V8 cooler from the company with an innovative design that incorporates a 3D Vapor Chamber and advanced super-conductive heatpipes in a singular assembly. The 3D Vapor Chamber is designed in a way so that the heat is evenly distributed throughout the heatsink using the composite heatpipes. The whole CPU heatsink is encased with a stylish shroud that has a very sharp black/silver design and comes with a dual 120mm Mobius fan.

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Image Source: Cooler Master

Key Features

In addition to the V8 3DVC, Cooler Master has also unveiled its brand new G11 AIO which is a 360mm design that comes with a dual-pump and dual-chamber layout which increases both pressure and heat dissipation. The radiator supports up to three 120mm Mobius fans and the pump features a very unique layout with a white casing with two RGB accent zones. This cooler comes with a 300W cooling capacity too.

Image Source: Cooler Master

The CPU pump also includes two side-mounted fans which provide additional airflow for better cooling capabilities.

Key Features

Once again, Cooler Master hasn't shared the pricing details of its V8 3DVC or G11 360mm AIO yet but we hope to share them with you soon.

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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