AMD's Ryzen AI 9 HX 370 APU has made its debut in the PassMark benchmark, delivering faster performance than Apple's M3 & Intel's 14700HX.
AMD's Ryzen AI 9 HX 370 "Strix" APU Delivers Strong Multi-Core Performance In PassMark, 28% Faster Than Predecessor
The flagship Ryzen AI 300 APU, the AMD Ryzen AI 9 HX 370, has appeared in various benchmarks and it looks like PassMark is the latest entry. The CPU has made its first appearance in the latest tests which show strong performance versus the competition but before we get to the results, let us take a quick look at the specifications the chip has to offer.
The AMD Ryzen AI 9 HX 370 APU is part of the Ryzen AI 300 "Strix Point" family and features a 12-core and 24-thread chip that features a four Zen 5 and eight Zen 5C configuration. This chip runs at up to 5.1 GHz boost clocks, offers 36 MB of cache (24 MB L3 + 12 MB L2), & the Radeon 890M iGPU with 16 compute units or 1024 cores. So versus the previous flagship, the Ryzen 9 8945HS, you are getting 50% more cores/threads, 33.3% more compute units, and 3.12x the NPU performance which is great gen-over-gen gains.
So for the performance, the AMD Ryzen AI 9 HX 370 APU scored 4213 points in the single-core and 37,699 points in the multi-core tests within PassMark. The CPU is listed as the 12th fastest laptop CPU on the PassMark database so let's see how the chip fares against other current-gen offerings:
PassMark Multi-Core (Higher is Better)
PassMark Single-Core (Higher is Better)
As you can see, the AMD Ryzen AI 9 HX 370 is faster than both the Apple M3 Max 14-core, Intel Core i7-14700HX 20-core, and even the Core Ultra 9 185H 16-core processors for laptops. AMD's latest Strix Point flagship offers a 28% uplift over the Hawk Point predecessor, the 8945HS too. It wasn't mentioned if the chip was running at its full 54W TDP or a configured power level but given these performance numbers, we can expect a relatively strong laptop offering with a powerful and modern iGPU which has shown great performance in leaked benchmarks.
AMD's first Ryzen AI 300 "Strix" laptops are expected to go on shelves on the 28th of July so the launch isn't far away. You can check out the first laptops from ASUS which are already listed and available for pre-orders at certain retailers.
AMD Ryzen AI 300 "Strix/Krackan" APUs:
| CPU Name | Cores / Threads | Core Config | Clock Speeds (Max) | Cache (Total) | AI Capabilities | iGPU | TDP |
|---|---|---|---|---|---|---|---|
| Ryzen AI 9 HX 375 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 85 AI TOPs (55 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 9 HX 370 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 9 HX PRO 370 | 12/24 | 4x Zen 5 / 8x Zen 5C | 2.0 / 5.1 GHz | 36 MB / 24 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 890M (16 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 365 | 10/20 | 4x Zen 5 / 6x Zen 5C | 2.0 / 5.0 GHz | 30 MB / 20 MB L3 | 80 AI TOPs (50 TOPS NPU) | Radeon 880M (12 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 PRO 360 | 8/16 | 3x Zen 5 / 5x Zen 5C | 2.0 / 5.0 GHz | 24 MB / 16 MB L3 | 72 AI TOPs (50 TOPS NPU) | Radeon 880M (12 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 7 350 | 8/16 | 4x Zen 5 / 4x Zen 5C | 2.0 / 5.0 GHz | 24 MB / 16 MB L3 | 66 AI TOPs (50 TOPS NPU) | Radeon 860M (8 CU @ 3.0 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 5 340 | 6/12 | 3x Zen 5 / 3x Zen 5C | 2.0 / 4.8 GHz | 22 MB / 16 MB L3 | 59 AI TOPs (50 TOPS NPU) | Radeon 840M (4 CU @ 2.9 GHz) | 28W (cTDP 15-54W) |
| Ryzen AI 5 330 | 4/8 | 1x Zen 5 / 3x Zen 5C | 2.0 / 4.5 GHz | 12 MB / 8 MB L3 | 50 TOPS (NPU) | Radeon 820M (2 CU @ 2.8 GHz) | 28W (cTDP 15-54W) |
News Source: @Olrak29_
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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