Recently, there were reports of AMD potentially going to Samsung for its future data center prospects but these claims have been denied by the company's CEO.
AMD Quashes Samsung Deal Rumors, Will Continue To Work With TSMC For Next-Gen MI300 GPUs
Over the past few months, we have been hearing rumors about AMD and Samsung possibly closing in on a deal to fabricate its next-generation chips using the South Korean giant's fabs. In the report, it was said that Samsung had secured 4nm orders from a major data center customer & almost all major S.Korean tech outlets reported on this development. Some said that it was possible that this data center client was none other than AMD.
AMD CEO Lisa Su poured cold water on the idea AMD might shift advanced GPU orders to Samsung, media report, asking Taiwan reporters if they really believed Korean media that said AMD would shift orders for next-gen products, including 3nm, to Samsung. She also said AMD’s MI300…
— Dan Nystedt (@dnystedt) July 21, 2023
However, during her visit to Taiwan, AMD's CEO, Dr. Lisa Su, refuted these claims and said that the company has not engaged in any deal with Samsung. Lisa Su also said that she won't comment on future supply chain cooperation plans with Taiwan, including TSMC but the Taiwanese chip maker will be a major partner of AMD and they will continue to work together. It is reported that AMD is currently the second largest customer of TSMC with a 10% sales share.
The CEO also stated that due without TSMC, the upcoming Instinct Mi300 chips wouldn't have been possible due to their incredibly complex designs which include an assortment of various chips like the 3D SoIC, CoWoS packages, and various other vertically stacked chips. It's an engineering marvel and AMD has beaten both Intel and NVIDIA in the domain of chiplets. NVIDIA has yet to fully absorb the chiplet architecture for its chips whereas Intel's design has only just been adopted by Aurora, a supercomputer that had missed various launch schedules.
But she also said that the MI300 series of chips integrate a variety of complex processes, including small chip stacking, 3D SoIC, and advanced packaging CoWoS, relying heavily on TSMC's technology, "it cannot be done without TSMC."
"Our relationship with Taiwan is very stable."
Highlighting the agenda of her recent visit to Taiwan, Dr. Lisa Su said that it was mainly to solidify and strengthen the relationship with supply chain partners and meet 1000s of employees within the country. AMD didn't have a major presence at Computex this year while Jensen Huang, NVIDIA CEO, not only held the opening keynote for the exhibition but also did waves throughout media & local news outlets since his presence basically made a tech celebrity & the company's exponential growth in AI overshadowed everyone else's announcements.
The AMD Instinct MI300 chips are expected to debut later this year and will be targeting the AI landscape with loads of performance.
News Sources: BusinessKorea , bnext
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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