ASUS has updated its Radeon HD 7870 with the latest version of Direct CU II Heatsink which features a better heat dissipation design which would allow more room for overclocking under sustainable temperatures.
For comparison, The newer model uses 8mm heatpipes curved in S-shape which run though the aluminum heatsink array block utilizing the Direct Touch feature, The older model used three 6mm heatpipes however they only covered one half of the aluminum block.
The Aluminum block itself is quite dense compared to the older one and is cooled by dual 80mm fans. The new HD 7870 Direct CU II V2 would retail for $349 MSRP and would feature the same specifications as the older model, The only difference would be the refined heatsink. Expect ASUS to use the newer version of Direct CU II on other models too.
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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