The choice to stick with TSMC’s second-generation 3nm process, also known as N3E, for the XRING 01 has allowed Xiaomi to cram in 19 billion transistors while also maintaining a smaller die size, making it an impressive feat when it comes to chip engineering. However, if we compare the latest SoC with the competition that utilizes the same lithography, Xiaomi’s latest solution is smaller than the A18 Pro, Dimensity 9400, and the Snapdragon 8 Elite. We now take a closer look at the four chipsets.
Apple’s A18 Pro is barely bigger than the XRING 01, measuring 110mm², but sticking with a smaller die is a decent, cost-effective strategy
A die size comparison was posted by notable content creator Geekerwan, showing that the only SoC larger than the XRING 01 is the Apple A18 Pro, measuring 110mm². The Snapdragon 8 Elite comes in at number three, measuring 124mm², with the Dimensity 9400 being the largest of the four at 126mm². For those wondering why Xiaomi did not proceed to make the XRING 01 slightly larger in dimensions, the reason is primarily related to costs.
Increasing the die size will increase the production bill, and seeing as how the XRING 01 will already be manufactured in fewer quantities, Xiaomi likely followed the approach of purposely reducing the die size, but not too much so as to compromise on its performance. A bigger die size will be costly to produce, but it offers a multitude of benefits, such as allowing chipset manufacturers to allocate larger cache sizes and increase performance accordingly.
This might be one reason why the XRING 01 relies on a 10-core CPU and a 16-core GPU, as reducing its die size likely meant that Xiaomi would have to introduce compensation elsewhere to offset the potentially lowered performance. Whether the increase in the number of cores will have an adverse effect on the power draw is something that we will touch on later. For now, look at the die size comparison above and let us know what you think in the comments.
News Source: Geekerwan
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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