Universal Chiplet Interconnect Express (UCIe) group combines AMD, Arm, Google, Intel, TSMC and more

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Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company revealed the construction of an industry consortium to designate a die-to-die to interconnect guideline and encourage an open chipset ecosystem.

Leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers join forces to standardize the chiplet ecosystem.

Highlights of the new standardized chiplet ecosystem:

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  • Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company established the new Universal Chiplet Interconnect Express (UCIe) technology to induct a chiplet ecosystem and forthcoming eras of chiplet technologies.
  • The new UCIe 1.0 specification was sanctioned to deliver a comprehensive standardized die-to-die interconnect with physical layer, protocol stack, software model, and compliance testing to encourage end-users to effortlessly swap chiplet components from a multi-vendor ecosystem System-on-Chip (SoC) structure, which also includes customized SoCs.
  • These new open standards will help establish an open chiplet ecosystem and universal interconnect at the package tier. Companies and institutions interested in joining the new ecosystem are highly supported to enter the new grouping of conglomerates freely.

The UCIe organization, illustrating a diverse ecosystem of market elements, will manage customer demands for more customizable package-level integration, merging best-in-class die-to-die interconnects and protocols from an interoperable, multi-vendor ecosystem.

Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company are forming an open industry standard organization to promote and further develop the technology and to establish a global ecosystem supporting chiplet design. For more information, visit www.UCIexpress.org.

The founding organizations also sanctioned the UCIe specification, an open industry standard created to designate a ubiquitous interconnect at the package level. The UCIe 1.0 specification covers the die-to-die I/O physical layer, die-to-die protocols, and software stack, which leverage the well-established PCI Express® (PCIe®) and Compute Express Link™ (CXL™) industry norms. The specification will be obtainable to UCIe partners and open to download on the organization's website.

The founding organizations portray a broad spectrum of industriousness expertise and contain leading cloud service providers, foundries, system OEMs, silicon IP providers, and chip designers. They are in the strategy of completing incorporation as an open measures group. Upon incorporating the new organization later this year, partnering companies will start operating on the next-gene UCIe technology, including determining the chiplet form factor, management, enhanced security, and other critical protocols. To discover more about membership opportunities, contact admin@UCIexpress.org.

Promoter Statements of Support for Universal Chiplet Interconnect Express (UCIe) gathering

AMD is proud to continue our long history of supporting industry standards that can enable innovative solutions addressing the evolving needs of our customers. We have been a leader in chiplet technology and welcome a multi-vendor chiplet ecosystem to enable customizable third-party integration. The UCIe standard will be a key factor to drive systems innovation leveraging heterogeneous compute engines and accelerators that will enable the best solutions optimized for performance, cost, and power efficiency.

— Mark Papermaster, Executive Vice President and Chief Technology Officer, AMD

Interoperability is essential to removing fragmentation across the Arm ecosystem, and across the industry. By collaborating with other leaders in computing, Arm is committed to helping develop standards and specifications like UCIe to enable the system designs of our future.

— Andy Rose, Chief System Architect and Fellow, Arm

“Integrating multiple chiplets in a package to deliver product innovation across market segments is the future of the semiconductor industry and a pillar of Intel’s IDM 2.0 strategy. Critical to this future is an open chiplet ecosystem with key industry partners working together under the UCIe Consortium toward a common goal of transforming the way the industry delivers new products and continues to deliver on the promise of Moore’s Law.

— Sandra Rivera, Executive Vice President, Intel Corporation and GM, Data Center & AI

Qualcomm is pleased that the industry is coming together to form UCIe, which should move chiplet technology forward—an important technology to address the challenges in our increasingly complex semiconductor systems.

— Dr. Edward Tiedemann, Senior Vice-President, Engineering, Qualcomm Technologies, Inc.

Samsung envisions chiplet technology becoming necessary for performance gains in computing systems as process nodes continue to scale, with dies inside each package eventually communicating through a single language. We expect the UCIe Consortium to foster a vibrant chiplet ecosystem and establish the framework for a viable open-standard interface industry-wide. As a total solutions provider for memory, logic, and foundry, Samsung anticipates spearheading consortium efforts to further identify the best ways for enhancing system performance through chiplet technology.

— Cheolmin Park, Vice President of Memory Product Planning Team at Samsung Electronics

TSMC is pleased to participate in this industry-wide consortium that will broaden the eco-system for package-level integration. TSMC offers various silicon and packaging technologies that provide multiple implementation options for heterogeneous UCIe devices.

— Lee-Chung Lu, TSMC Fellow and Vice President of Design and Technology Platform

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