TSMC's N2 processes are expected to see huge demand from the industry, even higher than 3nm, as customers are reportedly finding 2nm a 'cost-efficient' product.
TSMC's 2nm Process Is Claimed To Be Much More Attractive Relative to 3nm, Driven By Node Advancements
Well, in terms of process nodes and their generational advancements, TSMC's 2nm lineup is said to be a massive release for the firm, and with that, the node will see adoption from several key customers. According to a report by Ctee, it is claimed that TSMC plans 2nm wafer output to reach up to 100,000 by 2026, claiming that the cost structure is far more attractive compared to 3nm, and ultimately, the demand will be much higher as well.
Initially, the adoption of TSMC's N2 lineup will dominate the mobile segment, with Apple rumored to build four different chipsets on the process node. Similarly, both MediaTek and Qualcomm are anticipated to be the early adopters, and after them, HPC-focused firms such as NVIDIA and AMD will be the primary contributors to TSMC's 2nm revenue. Interestingly, it is claimed that the 2nm node is receiving a far higher interest compared to 3nm, since it would mark the first process where the Taiwan giant will adopt a nanosheet transistor structure.
The GAA transistor structure is claimed to allow TSMC to feature a similar number of EUV layers compared to 3nm, which means that the generational bump in pricing will be lower than expectations. The primary concern for firms like NVIDIA when it comes to employing TSMC's cutting-edge processes is the cost associated with it, but apparently, N2 and their derivatives will be in a lot more attractive position. TSMC has huge expectations with 2nm demand, which is why production ramp-up would be a lot more aggressive.
TSMC's 2nm mass production is currently slated for H2 2026, which means that adoption from tech giants could come in early 2027, depending upon how HVM turns out.
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