SK hynix plans to develop a new HBM memory standard which will be 30x faster than modern-day HBM products, to gain the lead in the competitive HBM market.
SK Hynix Is Set To Take Competition In HBM Markets To New Heights With Next-Gen Products, Offering Up To 30x Speedups
Speaking at the SK Icheon Forum 2024, Vice President of SK Hynix Ryu Seong-su disclosed that the Korean giant has huge ambitions for the HBM markets, claiming that the firm is working towards rapidly innovating the segment by introducing high-end next-gen HBM memory products. The official stated that the upcoming HBM memory is said to be around 20 to 30 times more potent than current HBM standards, and while he didn't disclose the actual HBM type itself, it's likely going to be a variant of HBM4 or a future generation product.
We aim to develop products with 20 to 30 times the performance of current HBM, focusing on introducing differentiated products.
- SK hynix's VP Ryu Seong-su
SK hynix aims to dominate the HBM sector by integrating advanced capabilities within its products, which means that the firm is right on track for the gigantic innovation anticipated in HBM4 products. HBM4 is set to be unique, utilizing logic and memory semiconductors in a single package. The Korean giant claims that adopting newer measures is vital for progression into the future, and HBM4 will set the tone for the future, given the potential capabilities it is said to come with.
Apart from this, SK Hynix claims that it has received massive interest from major tech firms in the AI markets, including Apple, Microsoft, Google Alphabet, and NVIDIA. SK hynix's VP claims that they are catering to custom engineering requests by these firms, and through this, the Korean giant aims to stay right at the top of the markets. Interestingly, SK hynix also expressed intentions to create its memory semiconductors, which means that the company is exploring options for expansion into the future.
We recently discussed HBM4 offerings from both Samsung and SK hynix, and while we are undoubtedly early to conclude whether one is superior, it's safe to say that the market competition is fierce this time. Both companies plan on releasing their respective HBM4 products by the middle or end of 2025, being right on time to make its integration possible in next-gen NVIDIA Rubin and other architectures.
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
Follow Wccftech on Google to get more of our news coverage in your feeds.
