Samsung’s Next-Gen LPDDR6X Memory Samples Have Already Been Delivered To Qualcomm

Feb 12, 2026 at 03:05am EST
A close-up of a Samsung LPDDR6X chip with its label visible against a blurred technological background.

Samsung has reportedly sent out samples of its next-gen LPDDR6X memory technology to Qualcomm ahead of its LPDDR6 launch.

Samsung Is Already Sending Out LPDDR6X Memory Samples To Firms Such As Qualcomm

I know this is our third Samsung-related post of the day, but the news is definitely interesting as it talks about the next-generation LPDDR6X memory standard. The information comes from a Korean outlet, the bell, who have managed to confirm that Samsung shipped samples of its next-gen LPDDR6X memory to Qualcomm.

Related Story JEDEC Approves SPHBM4 to Break HBM’s Costly Packaging Bottleneck, Retaining HBM4-level Speeds With Standard Packages

As of right now, Samsung has already done its work on LPDDR6 memory and is expected to commence mass production soon to meet the target launch of 2H 2026. Samsung's LPDDR6 memory standard will boast initial speeds of 10.7 Gbps with 21% higher efficiency than the LPDDR5 solution. At the same time, the standard is expected to see 14.4 Gbps+ speeds with improved variants.

LPDDR6X is an advanced version of LPDDR6 memory and will further expand the capabilities of the DRAM standard. Although the specifications have not been finalized yet for LP6X memory by JEDEC, we expect more information to come this year.

Coming back to the story, Samsung's LPDDR6X samples have been sent out to Qualcomm, who are likely going to use them in their AI Accelerator chip called the "AI250". This will be the follow-up to this year's AI200, which also leverages the LPDDR memory standard. Both chips are going to tackle AI inferencing workloads & are very similar to Intel's Crescent Island GPUs based on the Xe3P chips in the sense that both utilize the LPDDR standard.

While NVIDIA, AMD, Huawei, and other major data center chipmakers leverage HBM memory, those DRAM standards are costly, require more power, and there's an ongoing DRAM shortage. HBM is way harder to produce versus DDR due to its packaging, validation, and testing requirements. LPDDR DRAM saves the hassle and provides a lower cost. HBM is definitely way faster, but given the lower cost of LPDDR, it makes sense for cost-effective AI solutions. As such, Qualcomm is expected to feature up to 768 GB of LPDDR memory on its AI200, and the AI250 chip is expected to carry LPDDR6X capacities beyond 1 TB.

But as of right now, LPDDR6X memory is still a few years away. We can realistically expect the standard around late 2027 or early 2028.

News Source: Harukaze5719

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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