Samsung made a generational leap by introducing a novel heat sink within the Exynos 2600 chip, substantially improving its thermal stability in the process. Even so, with the upcoming Exynos 2700 chip, Samsung intends to build on its budding momentum by opting for an innovative side-by-side (SBS) architecture alongside a more refined heat sink, unlocking a significant jump in memory bandwidth.
Samsung is banking on a novel SBS architecture and a more refined heat sink to improve the real-world performance of its upcoming Exynos 2700 chip
As a refresher, the Exynos 2700 chip is expected to leverage Samsung's SF2P process, which is the next-gen iteration of the 2nm GAA process utilized by the Exynos 2600 chip.
For the benefit of those who might not be aware, the Gate-All-Around (GAA) is a 3D transistor architecture where the Gate completely envelopes the channel, which consists of vertically stacked nanosheets, from all four sides, resulting in improved electrostatic control and a lower voltage threshold.
As such, Samsung's new SF2P process is expected to yield a 12 percent hike in gross performance and a 25 percent reduction in the overall energy consumption relative to the previous-gen SF2 node.
Even so, the most profound change within the Exynos 2700 chip is expected to be centered on its layout. The Exynos 2600 sports a sandwich-like design, where the RAM is stacked on top of the SoC, and a copper-based heat sink (called Heat Path Block or HPB) sits on top of the RAM. While entailing greater thermal efficiency, this design still traps heat between the SoC and the RAM.
With the Exynos 2700 chip, however, Samsung intends to leverage its Fan-out Wafer Level Packaging (FOWLP) to place the RAM alongside the SoC, integrating the two at the wafer level. This architecture entails a number of advantages. First, given the much shorter interconnects, memory bandwidth is expected to jump by an estimated 30 percent to 40 percent, while also improving power efficiency. What's more, the HPB heat sink can then sit on top of the SoC and the RAM, resulting in material improvements to the chip's thermal stability.
The Exynos 2600 chip is already more thermally stable than Qualcomm's Snapdragon 8 Elite Gen 5 chip. With the innovation that Samsung is bringing to its next-gen Exynos 2700 chip, this admirable lead is only expected to grow further.
About the author: Writing is my one incontrovertible passion. Over the past six years, he has authored over 2,200 distinct articles on financial and tech-related topics, spanning nearly 1 million words. And he has been a member of Wcctech mobile team since 2025. As an alumnus of the University of Toronto, Rotman Commerce Program, I bring nuance, in-depth knowledge, and a unique perspective to every topic that I cover. When I'm not writing, I'm traveling the world, exploring hidden confectionaries and restaurants as an aspiring food connoisseur.
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