At the SAFE Forum 2026, Samsung announced that the development of its 1.4nm process is going smoothly, but the company also unveiled a new surprise; the company is working on an improved iteration called 1.4nm+, or SF1.4+. Additionally, a new 2nm roadmap was shared by the Korean giant during the conference as Samsung gets serious about sharing the competition pool with TSMC and Intel.
Updated 1.4nm+ process to enter mass production in 2030, with Samsung trailing behind TSMC and Intel
Only yesterday, we reported that Samsung might have delayed its 1.4nm process, but didn’t outright abandon the lithography, as the sub-2nm node would reportedly enter mass production in 2029. The year after that, the 1.4nm+ process, is expected to enter mass manufacturing in 2030. While Samsung has established a foundation of wanting to compete with TSMC and Intel in advanced manufacturing processes, the company is still an entire year behind its Taiwanese rival.
As for how Samsung will successfully boost its yields, seeing as how this obstacle has proved to be the firm’s Achilles’ Heel, especially when it was forced to delay the 1.4nm node for the sake of stabilizing the 2nm process, the company has switched to a method called Semiconductor Design and Process Integration Optimization (DTCO). This approach improves the power, performance, and area of updated manufacturing processes while maintaining the existing IP infrastructure.
Samsung says that employing DTCO will become even more important as process miniaturization begins. The same technique was applied to the company’s first-generation and second-generation 2nm GAA nodes, with power consumption and clock speeds improved by 26 percent and 15 percent, respectively.
Focusing on the 2nm process
Samsung is maintaining a dual-layer strategy as far as its foundry business goes, and while it’ll continue to develop the 1.4nm and 1.4nm+ processes, it’s also focusing on the third-generation 2nm GAA node, also known as SF2P+, which is targeted for mass production in 2027 or 2028. A customized version called SF2X is also being developed for AI and HPC customers while maintaining Samsung’s existing IP.
We’ve discussed previously that Samsung’s motivation for developing the 1.4nm process stems from Apple’s insistence on switching to the sub-2nm process after just two generations. Since AI customers will sooner or later pounce on this lithography, it’ll become increasingly difficult for Apple to secure supply, so its own encouragement doesn’t stem from gaining a foothold over its rivals, but rather to avoid a situation where inadequate supply harms its annual product shipments.
If Samsung plays its cards right, we believe it has a strong chance of nabbing Apple as a customer. After all, if Intel is reported to fabricate the upcoming M7, why doesn’t the Korean giant have a chance?
News Source: The Elec
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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