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Maxsun iCraft B760M Cross Motherboard Review – Anime-Themed With Great Design & Features For $150

Hassan Mujtaba

Maxsun has released a new motherboard aimed at mainstream gamers which is themed around its anime mascot, Aijia. The company has a vast array of Intel 700-series motherboards which are mostly confined to Asia Pacific markets. Still, the company is extending its reach to global PC users with its latest products. There's no doubt that the iCraft series from Maxsun are some of the most unique products out there and today, we will be taking a look at their iCraft B760M Cross which is an Intel LGA 1700 socketed motherboard featuring the B760 chipset.

The Intel LGA 1700 Platform

Intel's Raptor Lake-S desktop CPUs feature support on LGA 1700 socket which is also used by the Alder Lake CPUs. The Raptor Lake-S CPUs launched alongside the 700-series motherboards. You can expect all the top-notch specs from the Z790 motherboards with the best overclocking & fine-tuning capabilities.

Related Story Maxsun Squeezes Intel’s 10-Core Raptor Lake Onto a $200 Motherboard, Undercutting Traditional CPU+Board Combos by Nearly Half

Another interesting thing to talk about the Z790 PCH is its process node and dimensions. The Z790 PCH is based on the 14nm node and measures at 98mm2 which is slightly larger than the Z590 PCH featured on LGA 1200 socket motherboards.

Intel Desktop Platform Chipset Comparison

Chipset NameArrow Lake-S (ARL-S) PCH / 800 Series (Z890)Raptor Lake-S (RPL-S) PCH / 700 Series (Z790)Alder Lake-S (ADL-S) PCH / 600 Series (Z690)Rocket Lake-S (RKL-S) PCH / 500 Series (Z590)Comet Lake-S (CML-S) PCH / 400 Series (Z490)Coffee Lake S (CFL-S) PCH / 300 Series (Z390/H370, B360, Q370, H310)Coffee Lake S (KBL-R) PCH / Z370 Platform
Process Node7nm14nm14nm14nm14nm14nm22nm
Processor24C, 20C, 14C, 12C, TBD)24,16C,12C,10C,6C,4C16C,12C,10C,6C,4C (Full corporate/consumer SKU stack at launch)8C, 6C (Full corporate/consumer SKU stack at launch)10C, 8C, 6C, 4C, 2C (Full corporate/consumer SKU stack at launch)8C, 6C, 4C, 2C (Full corporate/consumer SKU stack at launch)8C, 6C, 4C (6 Consumer SKUs at Launch)
MemoryUp To DDR5-6400 (Native)Up To DDR5-5600 (Native)
Up To DDR4-3200 (Native)
Up To DDR5-4800 (Native)
Up To DDR4-3200 (Native)
Up To DDR4-3200 (Native)Up To DDR4-2933 (Native)Up To DDR4-2666 (Native)Up To DDR4-2666 (Native)
Media, Display & AudioeDP / 4DDI (DP, HDMI) Display CapabilitieseDP / 4DDI (DP, HDMI) Display CapabilitieseDP / 4DDI (DP, HDMI) Display CapabilitiesDP 1.2 & HDMI 2.0, HBR3
HDCP 2.2 (HDMI 2.0a w/LSPCON)
12-bit AV1/HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12
Integrated Dual-Core Audio DSP With USB Audio offload
SoundWire Digital Audio Interface
DP 1.2 & HDMI 1.4
HDCP 2.2 (HDMI 2.0a w/LSPCON)
HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12
Integrated Dual-Core Audio DSP
SoundWire Digital Audio Interface
DP 1.2 & HDMI 1.4
HDCP 2.2 (HDMI 2.0a w/LSPCON)
HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12
Integrated Dual-Core Audio DSP
SoundWire Digital Audio Interface
DP 1.2 & HDMI 1.4
HDCP 2.2 (HDMI 2.0a w/LSPCON)
HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12
Integrated Dual-Core Audio DSP
I/O & ConnectivityIntegrated USB 3.2 Gen 2x2 (20G)
Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+
Integrated SDXC 4.0 Controller
Thunderbolt 4.0
Integrated USB 3.2 Gen 2x2 (20G)
Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+
Integrated SDXC 4.0 Controller
Thunderbolt 4.0
Integrated USB 3.2 Gen 2x2 (20G)
Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+
Integrated SDXC 4.0 Controller
Thunderbolt 4.0
Integrated USB 3.2 Gen 2x2 (20G)
Integrated Intel Wireless-AC (Wi-Fi6E/ BT CNVi)
Integrated SDXC 3.0 Controller
Thunderbolt 4.0 (Maple Ridge)
Integrated USB 3.2 Gen 2
Integrated Intel Wireless-AC (Wi-Fi / BT CNVi)
Integrated SDXC 3.0 Controller
Thunderbolt 3.0 (Titan Ridge) w/ DP 1.4
Integrated USB 3.1 Gen 1 (5 Gbps)
Integrated Intel Wireless-AC (Wi-Fi / BT CNVi)
Integrated SDXC 3.0 Controller
Thunderbolt 3.0 (Titan Ridge) w/ DP 1.4
Integrated USB 3.1 Gen 1 (5 Gbps)
Thunderbolt 3.0 (Alpine Ridge)
StoragePCIe 5.0 (CPU Lanes), 8x SATA 3.0Next-Gen Intel Optane memory
PCIe 5.0 (CPU Lanes), 6x SATA 3.0
Next-Gen Intel Optane memory
PCIe 5.0, 6x SATA 3.0
Next-Gen Intel Optane memory
PCIe 4.0, 6x SATA 3.0
Next-Gen Intel Optane memory
PCIe 3.0, 6x SATA 3.0
Next Gen Intel Optane memory
PCIe 3.0, 6x SATA 3.0
Next Gen Intel Optane memory
PCIe 3.0, 6x SATA 3.0
Max PCH PCIe LanesUp To 24 (Gen 4)Up To 20 (Gen 4)
Up To 8 (Gen 3)
Up To 12 (Gen 4)
Up To 16 (Gen 3)
Up To 24 (Gen 3)Up To 24 (Gen 3)Up To 24 (Gen 3)Up To 24 (Gen 3)
Max CPU PCIe LanesUp To 20 (Gen 5)
Up To 4 (Gen 4)
Up To 16 (Gen 5)
Up To 4 (Gen 4)
Up To 16 (Gen 5)
Up To 4 (Gen 4)
Up To 20 (Gen 4)Up To 16 (Gen 3)Up To 16 (Gen 3)Up To 16 (Gen 3)
Max USB PortsUp To 5 (USB 3.2 Gen 2z2)
Up To 10 (USB 3.2 Gen 2x1)
Up To 10 (USB 3.2 Gen 1x1)
Up To 14 (USB 2.0)
Up To 5 (USB 3.2 Gen 2x2)
Up To 10 (USB 3.2 Gen 2x1)
Up To 10 (USB 3.2 Gen 1x1)
Up To 14 (USB 2.0)
Up To 4 (USB 3.2 Gen 2x2)
Up To 10 (USB 3.2 Gen 2x1)
Up To 10 (USB 3.2 Gen 1x1)
Up To 14 (USB 2.0)
Up To 3 (USB 3.2 Gen 2x2)
Up To 10 (USB 3.2 Gen 2x1)
Up To 10 (USB 3.2 Gen 1x1)
Up To 14 (USB 2.0)
Up To 10 (USB 3.2)
Up To 14 (USB 2.0)
Up To 10 (USB 3.1)
Up To 14 (USB 2.0)
Up To 10 (USB 3.0)
Up To 14 (USB 2.0)
SecurityIntel TET
Intel Boot Guard
N/AN/AN/AIntel SGX 1.0Intel SGX 1.0Intel SGX 1.0
Power ManagementC10 & S0ix Support for Modern StandbyC10 & S0ix Support for Modern StandbyC10 & S0ix Support for Modern StandbyC10 & S0ix Support for Modern StandbyC10 & S0ix Support for Modern StandbyC10 & S0ix Support for Modern StandbyC8 Support
Launch2024202220212021201920182017

The LGA 1700 socket is here now. The new socket adds more pins to the socket and changes the dimensions entirely. The new LGA 1700 socket offers 500 more pin connections to the CPU, allowing for more communication channels with the board itself and accommodating electrical pin configurations that are required to support 14th, 13th & 12th Gen CPUs.

So as for the socket details, Intel has gone with an asymmetrical design since the Alder Lake CPUs are no longer square-shaped. The latest desktop CPUs will come in a 37.5x45.0mm package and are supported by the 'V0' socket which we know as LGA 1700.

The socket also changes the mounting positions to a 78x78mm grid rather than a 75x75mm grid. The Z-height has also changed to 6.529mm compared to 7.31mm on the previous LGA 12**/115* sockets.

Cooler Compatibility With LGA 1700 Socket

To make their existing coolers compatible with Intel's Raptor Lake & Alder Lake CPU lineup, many cooling brands have released LGA 1700 upgrade kits which feature mounting hardware for the new socket. But the Intel Raptor Lake and the Alder Lake CPU platform aren't just featuring a brand new mounting design but the CPU dimensions themselves have changed too.

The LGA 1700 (V0) socket not only has an asymmetrical design but also comes with a lower Z-stack height. This means that proper mounting pressure is needed to make full contact with the Intel Alder Lake IHS. Certain cooler manufacturers have already been using larger cold plates for Ryzen and Threadripper CPUs to make proper contact with the IHS but these are mostly higher-end and new cooling designs. Those who are still running older AIOs with round cold plates could have trouble maintaining the required pressure distribution which could lead to inadequate cooling performance.

You can find additional information about our hardware review process and ethics policy here.

Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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