Intel Z790 Chipset - Top 700-Series PCH
Intel's Raptor Lake-S desktop CPU platform will feature support on LGA 1700 socket which is also used by the Alder Lake CPUs. The Raptor Lake-S processors will be launching alongside the 700-series motherboards. In addition to the flagship Z790 motherboards, B760 motherboards will also support memory overclocking which has been highly anticipated by budget PC builders but will be available in January 2023.
Another interesting thing to talk about the Z790 PCH is its process node and dimensions. The Z790 PCH is based on the 14nm node and measures at 98mm2 which is slightly larger than the Z590 PCH featured on LGA 1200 socket motherboards.
Intel Desktop Platform Chipset Comparison
| Chipset Name | Arrow Lake-S (ARL-S) PCH / 800 Series (Z890) | Raptor Lake-S (RPL-S) PCH / 700 Series (Z790) | Alder Lake-S (ADL-S) PCH / 600 Series (Z690) | Rocket Lake-S (RKL-S) PCH / 500 Series (Z590) | Comet Lake-S (CML-S) PCH / 400 Series (Z490) | Coffee Lake S (CFL-S) PCH / 300 Series (Z390/H370, B360, Q370, H310) | Coffee Lake S (KBL-R) PCH / Z370 Platform |
|---|---|---|---|---|---|---|---|
| Process Node | 7nm | 14nm | 14nm | 14nm | 14nm | 14nm | 22nm |
| Processor | 24C, 20C, 14C, 12C, TBD) | 24,16C,12C,10C,6C,4C | 16C,12C,10C,6C,4C (Full corporate/consumer SKU stack at launch) | 8C, 6C (Full corporate/consumer SKU stack at launch) | 10C, 8C, 6C, 4C, 2C (Full corporate/consumer SKU stack at launch) | 8C, 6C, 4C, 2C (Full corporate/consumer SKU stack at launch) | 8C, 6C, 4C (6 Consumer SKUs at Launch) |
| Memory | Up To DDR5-6400 (Native) | Up To DDR5-5600 (Native) Up To DDR4-3200 (Native) | Up To DDR5-4800 (Native) Up To DDR4-3200 (Native) | Up To DDR4-3200 (Native) | Up To DDR4-2933 (Native) | Up To DDR4-2666 (Native) | Up To DDR4-2666 (Native) |
| Media, Display & Audio | eDP / 4DDI (DP, HDMI) Display Capabilities | eDP / 4DDI (DP, HDMI) Display Capabilities | eDP / 4DDI (DP, HDMI) Display Capabilities | DP 1.2 & HDMI 2.0, HBR3 HDCP 2.2 (HDMI 2.0a w/LSPCON) 12-bit AV1/HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12 Integrated Dual-Core Audio DSP With USB Audio offload SoundWire Digital Audio Interface | DP 1.2 & HDMI 1.4 HDCP 2.2 (HDMI 2.0a w/LSPCON) HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12 Integrated Dual-Core Audio DSP SoundWire Digital Audio Interface | DP 1.2 & HDMI 1.4 HDCP 2.2 (HDMI 2.0a w/LSPCON) HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12 Integrated Dual-Core Audio DSP SoundWire Digital Audio Interface | DP 1.2 & HDMI 1.4 HDCP 2.2 (HDMI 2.0a w/LSPCON) HEVC & VP9 10-bit Enc/Dec, HDR, Rec.2020, DX12 Integrated Dual-Core Audio DSP |
| I/O & Connectivity | Integrated USB 3.2 Gen 2x2 (20G) Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+ Integrated SDXC 4.0 Controller Thunderbolt 4.0 | Integrated USB 3.2 Gen 2x2 (20G) Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+ Integrated SDXC 4.0 Controller Thunderbolt 4.0 | Integrated USB 3.2 Gen 2x2 (20G) Integrated Intel Wireless-AC (Wi-Fi6E/ 7 BT CNVio) with Gig+ Integrated SDXC 4.0 Controller Thunderbolt 4.0 | Integrated USB 3.2 Gen 2x2 (20G) Integrated Intel Wireless-AC (Wi-Fi6E/ BT CNVi) Integrated SDXC 3.0 Controller Thunderbolt 4.0 (Maple Ridge) | Integrated USB 3.2 Gen 2 Integrated Intel Wireless-AC (Wi-Fi / BT CNVi) Integrated SDXC 3.0 Controller Thunderbolt 3.0 (Titan Ridge) w/ DP 1.4 | Integrated USB 3.1 Gen 1 (5 Gbps) Integrated Intel Wireless-AC (Wi-Fi / BT CNVi) Integrated SDXC 3.0 Controller Thunderbolt 3.0 (Titan Ridge) w/ DP 1.4 | Integrated USB 3.1 Gen 1 (5 Gbps) Thunderbolt 3.0 (Alpine Ridge) |
| Storage | PCIe 5.0 (CPU Lanes), 8x SATA 3.0 | Next-Gen Intel Optane memory PCIe 5.0 (CPU Lanes), 6x SATA 3.0 | Next-Gen Intel Optane memory PCIe 5.0, 6x SATA 3.0 | Next-Gen Intel Optane memory PCIe 4.0, 6x SATA 3.0 | Next-Gen Intel Optane memory PCIe 3.0, 6x SATA 3.0 | Next Gen Intel Optane memory PCIe 3.0, 6x SATA 3.0 | Next Gen Intel Optane memory PCIe 3.0, 6x SATA 3.0 |
| Max PCH PCIe Lanes | Up To 24 (Gen 4) | Up To 20 (Gen 4) Up To 8 (Gen 3) | Up To 12 (Gen 4) Up To 16 (Gen 3) | Up To 24 (Gen 3) | Up To 24 (Gen 3) | Up To 24 (Gen 3) | Up To 24 (Gen 3) |
| Max CPU PCIe Lanes | Up To 20 (Gen 5) Up To 4 (Gen 4) | Up To 16 (Gen 5) Up To 4 (Gen 4) | Up To 16 (Gen 5) Up To 4 (Gen 4) | Up To 20 (Gen 4) | Up To 16 (Gen 3) | Up To 16 (Gen 3) | Up To 16 (Gen 3) |
| Max USB Ports | Up To 5 (USB 3.2 Gen 2z2) Up To 10 (USB 3.2 Gen 2x1) Up To 10 (USB 3.2 Gen 1x1) Up To 14 (USB 2.0) | Up To 5 (USB 3.2 Gen 2x2) Up To 10 (USB 3.2 Gen 2x1) Up To 10 (USB 3.2 Gen 1x1) Up To 14 (USB 2.0) | Up To 4 (USB 3.2 Gen 2x2) Up To 10 (USB 3.2 Gen 2x1) Up To 10 (USB 3.2 Gen 1x1) Up To 14 (USB 2.0) | Up To 3 (USB 3.2 Gen 2x2) Up To 10 (USB 3.2 Gen 2x1) Up To 10 (USB 3.2 Gen 1x1) Up To 14 (USB 2.0) | Up To 10 (USB 3.2) Up To 14 (USB 2.0) | Up To 10 (USB 3.1) Up To 14 (USB 2.0) | Up To 10 (USB 3.0) Up To 14 (USB 2.0) |
| Security | Intel TET Intel Boot Guard | N/A | N/A | N/A | Intel SGX 1.0 | Intel SGX 1.0 | Intel SGX 1.0 |
| Power Management | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C10 & S0ix Support for Modern Standby | C8 Support |
| Launch | 2024 | 2022 | 2021 | 2021 | 2019 | 2018 | 2017 |
Meet The LGA 1700 Socket - 13th & 12th Generation CPU Support
The LGA 1700 socket is here now. The new socket adds more pins to the socket and changes the dimensions entirely. The new LGA 1700 socket offers 500 more pin connections to the CPU, allowing for more communication channels with the board itself and accommodating electrical pin configurations that are required to support 13th & 12th Gen CPUs.
So as for the socket details, Intel is going with an asymmetrical design which poses since the Alder Lake CPUs are no longer square-shaped. The Alder Lake desktop CPUs will come in a 37.5x45.0mm package and will be supported by the 'V0' socket which we know as LGA 1700. The new socket also changes the mounting positions to a 78x78mm grid rather than a 75x75mm grid. The Z-height has also changed to 6.529mm compared to 7.31mm on the previous LGA 12**/115* sockets.
| Specifications | |
|---|---|
| Intel LGA1700 Socket details | |
| IHS to MB Height (Z-Stack, validated range): | 6.529 – 7,532 mm |
| Thermal Solution Hole Pattern: | 78 x 78 mm |
| Socket Seating Plane Height: | 2.7 mm |
| Maximum Thermal Solution Center of Gravity Height from IHS: | 25.4 mm |
| Static Total Compressive Minimum: | 534N (120 lbf), Beginning of Life 356 N (80 lbf) |
| End of life maximum: | 1068 N (240 lbf) |
| Socket Loading: | 80-240 lbf |
| Dynamic Compressive Maximum: | 489.5 N (110 lbf) |
| Maximum Thermal Solution Mass: | 950 gm |
| Important Note: | A Keep In Zone is introduced for LGA17xx-18xx thermal solutions. Two volumes are provided. The Asymmetric volume provides the maximum available design space. The Symmetric volume provides for designs to be rotatable on the board. The thermal solution under load should fit within the volume |
What's interesting is that the Alder Lake CPUs use an asymmetrical design and while we don't know how the dies will be positioned under the IHS, we do know from AMD Threadripper that CPUs that carry such design require full IHS coverage and that may be the tricky part when it comes to cooling the brand new Alder Lake CPUs. So far, we know that Alder Lake will be a monolithic yet hybrid CPU design so it remains to be seen how cooling is handled for these 12th Generation chips.
Cooler Compatibility With LGA 1700 Socket
To make their existing coolers compatible with Intel's Raptor Lake & Alder Lake CPU lineup, many cooling brands have released LGA 1700 upgrade kits which feature mounting hardware for the new socket. But the Intel Raptor Lake and the Alder Lake CPU platform aren't just featuring a brand new mounting design but the CPU dimensions themselves have changed too.
The LGA 1700 (V0) socket not only has an asymmetrical design but also comes with a lower Z-stack height. This means that proper mounting pressure is needed to make full contact with the Intel Alder Lake IHS. Certain cooler manufacturers have already been using larger cold plates for Ryzen and Threadripper CPUs to make proper contact with the IHS but these are mostly higher-end and new cooling designs. Those who are still running older AIOs with round cold plates could have trouble maintaining the required pressure distribution which could lead to inadequate cooling performance.
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About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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