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Hardware

AMD Ryzen 9 7950X3D CPU Review Ft. MSI MAG X670E Tomahawk – The Most Efficient High-End CPU

Hassan Mujtaba

MSI MAG X670E Tomahawk Motherboard - Unboxing

For this particular review, we used MSI's MAG X670E Tomahawk motherboard which has the latest BIOS that allows for out of box compatibility with the AMD Ryzen 7000 X3D CPUs. The motherboard was sent to us by MSI just a few days ahead of the launch so we thought it would be wise to use it as our test platform for the new X3D parts.

The MSI MAG X670E Tomahawk motherboard comes in the standard cardboard package. The front is themed in silver and grey. The motherboard is part of the MAG or Massive Arsenal Gaming line & offers all the basic features plus a bit more at a handsome price point.

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The backside of the package lists the specifications and special features of the motherboard such as the 14 Phase DUET VRM Solution, Lightning 20G USB ports, WiFi 6E support, Lightning Gen5 slots and M.2 Shield Frozr heatsinks.

Inside the package is another box that contains the accessories at the bottom. It is very easy to access although the accessories and each of them are nicely packed in three compartments. The following is the full list of accessories in the package.

  • Quick Installation Guide / EU Regulatory Notice
  • 2 x SATA Cables
  • 3 x M.2 Clip
  • M.2 Plate Screw
  • Cable Stickers
  • 1 x Antenna (WiFi)

The motherboard is housed above the accessories and has anti-static wrapping to protect it from any built-up electrical resistance that can affect the board.

The MSI MAG X670E Tomahawk comes with a discrete look that includes no RGB implementation, making it perfect for RGB heartens. The whole black design looks absolutely great and reminds me of the MSI Unify series.

You can find additional information about our hardware review process and ethics policy here.

Hassan Mujtaba Photo

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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