Google has once again been unsuccessful in keeping its Pixel 10 leaks under wraps. A prototype belonging to the upcoming lineup’s more premium version, the Pixel 10 Pro, has been spotted in the wild, with the device shown from nearly all angles. We also learn about some internal specifications, with a bevy of details mentioned below.
The Tensor G5 configuration belonging to the Pixel 10 Pro prototype is a major disappointment, with the device showing little to no design differences from the Pixel 9 Pro
A DVT, or Design Verification Test, prototype of the Pixel 10 Pro has been making the rounds on a Chinese social media platform called ‘coolapk,’ with the details shared by Mystic Leaks, and the remaining information published by Android Authority. The leak presents a closer look at the Tensor G5, which sports an 8-core CPU and features a single Cortex-X4, two Cortex-A725 cores, three Cortex-A725 cores, and two low-power Cortex-A520 cores.
The app likely made an error in mentioning that the Tensor G5 is a 5nm SoC because it has been stated numerous times that Google will leverage TSMC’s second-generation 3nm node to mass produce its next chipset. The remaining hardware of the Pixel 10 Pro prototype was 16GB of RAM and 256GB of storage. As for the software, the device appears to be running a non-QPR1 version of Android 16.
Google is not introducing any major design changes compared to the Pixel 9 Pro, but the Pixel 10 Pro prototype is flaunting a significantly larger camera bump, hinting that the rest of the chassis is at least slightly thinner than the predecessor. Looking at the smartphone from the back, we also noticed three primary cameras.
Keep in mind that the commercial unit will look more or less like the DVT one, and Google may give the retail version a subtle aesthetic makeover. For now, we recommend readers wait for the official announcement later in the year, and as always, we will provide routine updates in the future.
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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