MSI Pushes 128 GB DDR5 to 9400 MT/s on X870E Unify-X MAX, Hints Bigger Gains With Next-Gen Ryzen

Apr 22, 2026 at 07:20am EDT
A close-up of an MSI Unify X motherboard showing its sleek design and cooling components.

MSI demonstrated the DDR5 memory overclocking capabilities of its MEG X870E Unify-X MAX board with an upcoming BIOS while hinting at improved OC with future Ryzen CPUs.

MSI's Newest X870E Unify-X MAX BIOS Pushes 128 GB 2-Rank DDR5 Memory To 9400 MT/s Speeds

Toppc, MSI's in-house overclocker and engineer of the motherboard division, has once again showcased the OC capabilities of the latest AM5 MAX series motherboards.

Related Story AMD Says It Will Bring New Zen Architectures & Products To AM5 Through 2029, But The Next Socket Will Only Arrive When DDR6/PCIe Make Sense

The overclocker used the brand new MSI MEG X870E Unify-X MAX motherboard, which is a top-of-the-line, enthusiast-grade design for overclockers and enthusiasts. The motherboard features a 2-DIMM layout for enhanced memory overclocking and offers memory support across a wide range of OC-Ready kits.

In the overclocking demonstration, MSI coupled the motherboard with an AMD Ryzen 5 9600X CPU and used the upcoming "1.A0B" BIOS, which is based on the AGESA 1.3.0.0 BIOS firmware. With this, the board was able to successfully boot a pair of 64 GB Dual-Rank DDR5 memory kits, equaling 128 GB of capacity. The memory modules were running at 9400 MT/s speeds, which is absolutely bonkers for a 128 GB kit to run at. The motherboard does support over 10,000 MT/s speeds on 24/32 GB kits, but doing so with a 2-rank 128 GB kit is mighty impressive.

In his post on Facebook, Toppc says that this would be it as far as major updates for the current AM5 lineup will roll out. The next major updates are said to roll out with the next generation of Ryzen CPUs from AMD, likely referring to the Zen 6 family.

Double-sided 64GB x 2, double-sided 64GB x 2, double-sided 64GB x 2 DDR5-9400 finally booted up! MSI X870E UNIFY-X AM5 platform, 64GB x 2, 128GB. The BIOS is expected to be released next week; after that, we should wait for the next generation of CPUs.

Toppc - MSI Engineer and Overclocker

Now there have been a lot of talks regarding the Zen 6-based Ryzen CPUs. We know that they will feature up to 24 cores and also offer support on the same AM5 socketed motherboards. One crucial aspect is the updated EXPO design. In previous leaks, we have learned that AMD is preparing a new EXPO technology for its upcoming motherboards, allowing CUDIMM support on AMD platforms.

Currently, Intel offers CUDIMM and CQDIMM support on its LGA 1851 platforms and will continue to extend memory capabilities on future platforms, such as Nova Lake on LGA 1954. So AMD is expected to be on par in terms of memory technology support.

They have already bridged the gap in terms of DDR5 speeds. Intel was previously leading with over 8000-9000 MT/s modules supported on its platforms, but with the latest AGESA BIOS updates, AMD partners such as MSI now offer solid speeds on their current designs, so we can expect these to get better in the coming generation.

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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