Micron is now looking to gobble up general-purpose GDDR memory modules by creating an HBM-like solution with them, and this might further fuel shortages for gamers.
Micron Plans to Utilize Gaming GPU-Focused GDDR Memory Modules For AI By Stacking Them Together
The memory industry is working to meet the demands of modern-day AI workloads, and companies are exploring various methods to overcome this challenge. While traditional HBM technologies were adequate for training frontier models, as we move towards inference, memory has become the next major focus. A report by ETNews reveals that Micron is now looking to stack GDDR modules, likely to create a solution with significantly higher capacities than current solutions, which could prove to be an interesting venture.
Initial GDDR stacking of around four layers is expected. Prototypes (samples) could be released as early as next year.
- ETNews
GDDR is a segment that hasn't been influenced by the AI frenzy as dramatically as LPDDR or DDR, since its use case had previously been confined to gaming GPUs. Given that Micron plans to vertically stack GDDR to offer the industry a solution, it may be that the company has sufficient capacity on board and, instead of easing GPU market shortages, finds it better to cater to enterprise demand. The report noted that the stacked GDDR solution won't be on par with HBM in terms of performance, but it would offer higher capacities, complementing modern-day inference workloads.
GDDR stacking is a newly explored concept, and while the report doesn't provide technical details on how the solution could look. Micron's SOCAMM2 has already explored the prospect of stacking general-purpose DRAM, such as LPDDR5X, up to 16-Hi, and the firm has achieved up to 256 GB per module. However, stacking LPDDR5X is much easier than GDDR, given that the former is a power-efficient module with manageable thermals. With GDDR, the primary issues Micron could face are maintaining thermal and signal integrity if it sticks to wire bonding.
There are multiple ways Micron could address the issues with GDDR stacking by trading off clock speeds, but the report highlights that the memory giant is pursuing innovation in the memory segment. We have seen that Micron experienced hiccups with HBM4 following a delay in NVIDIA's certification, and while the firm has provided modules for Vera Rubin, supply allocation has dropped, while competitors like Samsung have seen an increase. A GDDR-stacked solution could stand out in the memory market if it proves cost-effective relative to HBM.
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
Follow Wccftech on Google to get more of our news coverage in your feeds.
