Intel has placed a massive order at Taiwanese manufacturers to secure advanced packaging equipment, which will be used for its EMIB plans.
Intel Bets Big on EMIB, As The Company Has Placed A Huge Order To Secure Advanced Packaging Equipment From Taiwan
EMIB, the advanced packaging solution and alternative to TSMC's CoWoS, has been making headlines for some time now. The packaging technology is gaining lots of momentum as potential customers line up to utilize the tech for their upcoming chips, mainly for AI purposes. This demand has now led Intel to go after Taiwanese manufacturers to secure the equipment required for EMIB's readiness.
As per the Taiwanese outlet, Investor, it is reported that TSMC's constraints with its CoWoS packaging have led international customers to turn towards Intel for capacity. Since the demand for bleeding-edge AI chips continues to skyrocket, Intel is now adding more equipment to boost its EMIB capacity, which has reportedly achieved 90% yield rates, and is now aiming for 98%, which is crucial to make it a viable option for higher-end customers such as Apple.
Many international manufacturers are turning to Intel for capacity, giving Intel a bargaining chip. Recently, it has been reported in the supply chain that Intel has released a huge equipment purchase order to Taiwanese equipment manufacturers to simultaneously launch the expansion of EMIB advanced packaging plants in Oregon, USA, and Vietnam. Beneficiaries, the industry has named equipment manufacturers such as Tisen, Chih Sheng, and Inerergy Technology.
Machine Translate via Investor
The two key factors for EMIB to become a success are production yields and power efficiency. Intel has been marketing EMIB a lot lately, showcasing its advantages over TSMC's CoWoS, its lower cost, scalable design, and the ability to match higher-end packages such as TSMC's SoW. Though Intel has yet to roll out any external chip using EMIB. The company has produced its own in-house solutions leveraging EMIB, but that is far from
Under the new expansion plans for EMIB, the company will be focusing its efforts at its Oregon plant in the United States. Secondary expansion will also be made at its Vietnam facility. The expansion plan includes procuring packaging and testing equipment from Taiwanese manufacturers, including Tissin (Last Equipment Manufacturer), Chihsheng (Dry Process Equipment Manufacturer), and Intronics (Bubble Oven Equipment Manufacturer).
Large orders have been made at each respective manufacturer, and Intel is set to get deliveries in the second half of 2026. Furthermore, EMIB warpage issues are also being addressed with Santex partnering with Intel to address the issues quickly and through simple means.
Recently, EMIB has said to gain traction at Google, which is expected to leverage the tech for its next-gen Humufish TPU chip. OpenAI has also proposed an EMIB-like solution to scale up existing AI chips, while NVIDIA is in line to be a major customer for EMIB with its Feynman GPUs. EMIB is just one equation of the broader Intel Foundry plan, which involves 18A-P and 14A process technologies, putting the company back in the semiconductor business as a major player.
News Source: Dan Nystedt
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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