NVIDIA now looks to add more "CoWoS" suppliers to its pool, & one of the leading names popping up is none other than Intel Foundry.
NVIDIA & The AI Hype Might Prove To Be a Breakthrough For Intel's Foundry Division, Expected To Be Used For H100 GPU Production
Well, it looks like Team Green is having a hard time keeping up with the demand from the markets, which is why NVIDIA has been consistently adding new partners in the supply chain to ensure a seamless ordering experience for its clients. Team Green has been proactive in driving partners into upscaling their production facilities, especially in the department of packaging equipment, but despite efforts, it looks like NVIDIA isn't seeing the optimal supply, which is why they are looking to add in more partners, with Intel Foundry being a top contender.
Yes, you heard it right. It is now being reported that NVIDIA is considering IFS as a key ally for its packaging needs, and interestingly, Intel will start supplying the tech giant as soon as next month. Intel Foundry has seen roadblocks enter its way, whether through division policies or even interest from the markets, but it looks like IFS has found its way out, with credit to the AI hype.
Under Intel's IDM 2.0 strategy, which is a roadmap towards making IFS a global semiconductor giant, Team Blue has been heavily investing in its facilities, which is why it has attained a spot in the eyes of NVIDIA. Apart from that, Intel's CEO Pat Gelsinger recently expressed the intention of IFS to turn into an "AI factory," which meant that the firm would focus specifically on products associated with the AI hype, including packaging facilities and with the NVIDIA breakthrough, Intel is one step ahead in achieving its goal.
It is said that the IFS plans to supply NVIDIA with 5,000 packaging wafers per month, which is significantly larger than what competitors such as TSMC are providing, but there is room for expansion. IFS might be given responsibility for NVIDIA's "in-demand" Hopper generation of AI products, including accelerators such as the H100s. In terms of the advanced packaging to be supplied, NVIDIA is said to show massive interest in Intel's Foveros 3D stacking technology, which is said to be a direct competitor of TSMC's mainstream CoWoS-S packaging process.
Well, with NVIDIA and IFS collaborating, it certainly will mean a huge opportunity for Intel to achieve a breakthrough. Given that Team Blue isn't having a good time with finances right now, this might prove to be a blessing in disguise.
News Source: MyDrivers
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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