Intel’s Next-Gen Diamond Rapids-AP “Xeon” CPUs Utilize Massive LGA 9324 Socket on “Oak Stream” Platform, 5 Times Larger Than LGA 1700

Aug 22, 2024 at 03:50am EDT
Intel's Next-Gen Diamond Rapids-AP "Xeon" CPUs Utilize Massive LGA 9324 Socket on "Oak Stream" Platform, 5 Times Larger Than LGA 1700

Intel's next-generation Diamond Rapids "Xeon" CPUs are going to feature support on a massive LGA 9324 socket which almost nears 10K contacts.

Forget LGA 7529, Intel's LGA 9324 To Be The Biggest Socket Ever Made With Support For Diamond Rapids CPUs

The Intel LGA 7529 socket featured on the Birch Stream platform will be a massive design, featuring a total of 7529 gold contact pads which will support up to 128 core Xeon 6900P "Granite Rapids", & up to 288 core Xeon 6900E "Sierra Forest" CPUs. This socket will debut this quarter with the launch of Granite Rapids-AP chips but Intel is already working towards its next-gen socket which will take things to the next level.

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Spotted by @harukaze5719, the Intel LGA 9324 socket is going to be gargantuan, featuring almost 10,000 gold contact pads. This socket was listed on Intel's Designintools webpage. The massive socket will be supporting Intel's next-gen Diamond Rapids CPUs as mentioned on the webpage and it looks like the details refer to the AP series which will be the follow-up to Granite Rapids-AP "Xeon 6900P".

The LGA 9324 CPU socket is also part of the Oak Stream platform which will be the follow-up to the Birch Stream platforms which are divided into two segments, the LGA 4710 socket & the LGA 7529 socket. The LGA 4710 socket features the Beechnut City reference evaluation platform while the LGA 7529 socket features the Avenue City reference evaluation platform.

The RVP for Oak Stream platforms aren't confirmed yet but we can expect them to be massive in terms of size. The larger socket will also feature a bigger size and most probably a 16-channel DRAM solution to enable a high-density memory platform.

Previous reports stated that Intel may end up using the LGA 7529/4710 sockets for Diamond Rapids CPUs but it looks like the company isn't going that route. The CPUs are expected to further boost up the core counts and will launch sometime around 2025-2026 with EPYC "Venice" being its direct competitor which also comes on a brand new SP7 socket and features up to 16-channel memory support.

With Intel once again being seen in a competitive position against AMD's Zen 5 offerings with its Granite Rapids and Sierra Forest lineup, it will be interesting how things stack up in the coming years in the data center and HPC segment. NVIDIA is also expected to introduce its Vera CPU lineup by 2026, further putting pressure on the x86 rivals.

Intel Xeon CPU Families (Preliminary):

Family BrandingCoral RapidsDiamond RapidsClearwater ForestGranite RapidsSierra ForestEmerald RapidsSapphire RapidsIce Lake-SPCooper Lake-SPCascade Lake-SP/APSkylake-SP
Process NodeIntel 14A?Intel 18A-PIntel 18AIntel 3Intel 3Intel 7Intel 710nm+14nm++14nm++14nm+
Platform NameTBDIntel Oak StreamIntel Birch StreamIntel Birch StreamIntel Mountain Stream
Intel Birch Stream
Intel Eagle StreamIntel Eagle StreamIntel WhitleyIntel Cedar IslandIntel PurleyIntel Purley
Core ArchitectureTBDPanther Cove-XDarkmontRedwood CoveSierra GlenRaptor CoveGolden CoveSunny CoveCascade LakeCascade LakeSkylake
MCP (Multi-Chip Package) SKUsYesYesYesYesYesYesYesNoNoYesNo
SocketTBDLGA XXXX / 9324LGA 4710 / 7529LGA 4710 / 7529LGA 4710 / 7529LGA 4677LGA 4677LGA 4189LGA 4189LGA 3647LGA 3647
Max Core CountTBDUp To 192 P-CoresUp To 288Up To 128Up To 288Up To 64?Up To 56Up To 40Up To 28Up To 28Up To 28
Max Thread CountTBDUp To 192Up To 288Up To 256Up To 288Up To 128Up To 112Up To 80Up To 56Up To 56Up To 56
Max L3 CacheTBDTBDTBD480 MB L3108 MB L3320 MB L3105 MB L360 MB L338.5 MB L338.5 MB L338.5 MB L3
Memory SupportTBDUp To 16-Channel DDR5-9000+Up To 12-Channel DDR5-8000Up To 12-Channel DDR5-6400
MCR-8800
Up To 12-Channel DDR5-6400Up To 8-Channel DDR5-5600Up To 8-Channel DDR5-4800Up To 8-Channel DDR4-3200Up To 6-Channel DDR4-3200DDR4-2933 6-ChannelDDR4-2666 6-Channel
PCIe Gen SupportPCIe 6.0PCIe 6.0PCIe 5.0 (96 Lanes)PCIe 5.0 (136 Lanes)PCIe 5.0 (88Lanes)PCIe 5.0 (80 Lanes)PCIe 5.0 (80 lanes)PCIe 4.0 (64 Lanes)PCIe 3.0 (48 Lanes)PCIe 3.0 (48 Lanes)PCIe 3.0 (48 Lanes)
TDP Range (PL1)TBDTBDUp To 500WUp To 500WUp To 350WUp To 350WUp To 350W105-270W150W-250W165W-205W140W-205W
3D Xpoint Optane DIMMTBDTBDN/ADonahue PassN/ACrow PassCrow PassBarlow PassBarlow PassApache PassN/A
CompetitionTBDAMD EPYC VeniceAMD EPYC TurinAMD EPYC TurinAMD EPYC BergamoAMD EPYC Genoa ~5nmAMD EPYC Genoa ~5nmAMD EPYC Milan 7nm+AMD EPYC Rome 7nmAMD EPYC Rome 7nmAMD EPYC Naples 14nm
Launch2028-20292027202620242024202320222021202020182017

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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