HTC Nexus Sailfish Build File Shows The Smartphone Is Going To Be Packing A Snapdragon 820

Jul 25, 2016 at 04:59am EDT
HTC Nexus Sailfish Build File Shows The Smartphone Is Going To Be Packing A Snapdragon 820

Some leaks become the most common sight and others reveal interesting features of smartphones in a very unique manner. For the upcoming HTC Nexus Sailfish, a build file leak shows that the upcoming smartphone is going to be packing a Snapdragon 820 underneath its hood.

If HTC Nexus Sailfish Will Feature A Snapdragon 820, Then Which Chipset Will The HTC Nexus Marlin Possess?

Twitter holds many secrets for us, and for HTC Nexus Sailfish, those secrets have been fulfilled to a large extent. If you pay close attention to the build file, you will notice the model name msm8896, which is a clear indication of a Snapdragon 820. Being a flagship, it was always on the cards that the smartphone was going to feature this SoC, but with HTC, you never know what sort of drastic decision it might end up taking, with a terrific example being the firm’s One A9 handset.

As far as the remaining hardware of the other upcoming HTC Nexus Marlin goes, Qualcomm announced its Snapdragon 821 very recently, thus confirming that Snapdragon 820 does have a successor that is going to be present in mobile devices during the 2016 Calendar year. Now the question is, which Nexus phone is going to feature the powered SoC?

If you wanted to know the differences between Snapdragon 821 and Snapdragon 820, they have been listed below:

Snapdragon 820

Snapdragon 821

HTC is also said to announce its Sailfish handset alongside the 5.5-inch powerhouse, and here are its leaked specifications.

Remember, the aforementioned specifications should be taken with a grain of salt, and as soon as the specs of the smartphone are thoroughly confirmed, we will place all information for you right here.

Source

About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.

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