The Pixel 11 lineup is expected to launch later this year with Google’s Tensor G6, and if you thought that the company is shifting to an alternative like a flagship Snapdragon or MediaTek SoC to gain an upper hand against the competition, you assumed incorrectly. The Mountain View firm is sticking to its Tensor SoCs with the Pixel 12 family next year, with fresh details of the silicon showcased in the latest leak.
Tensor G7 is being developed for Google’s Pixel 12, with a new leak revealing its codename to be Lajolla or LaJolla
From the looks of it, Google appears to remain loyal to its Tensor SoCs for the long haul, with the Tensor G7 expected to power the Pixel 12’s innards. According to MysticLeaks on Telegram, we now learn that the codename of this chipset is Lajolla or LaJolla, which likely refers to the La Jolla area in San Diego.
Unfortunately, these are the only details available to us right now, but like the Tensor G6, which is said to be Google’s first 2nm SoC that is mass produced by TSMC, Tensor G7 will likely stick with the same lithography as the Taiwanese semiconductor giant will have an improved iteration of its 2nm node.
Sadly, we don’t believe that Tensor G7 is going to be a heavyweight in the performance department since, historically, Google has always prioritized its chipsets to cater to users’ requirements instead of being ridiculously fast. If you don’t remember, the company’s Tensor G5 is currently Google’s fastest SoC, but in raw compute performance, it’s barely faster than the older Snapdragon 8 Gen 3.
This difference has rubbed consumers the wrong way, as Google continues to charge a premium for its smartphones despite these devices being slower than the competition. At some point, Tensor chips will need to become as fast as their rivals, so let us keep our fingers crossed if the Tensor G7 release will change anything.
News Source: MysticLeaks
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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