New technologies were used to mass produce the Exynos 2400, with one of them being Samsung’s 4LPP+ process, which has not only improved yields but also increased power efficiency. However, one important tidbit that the company left out but did manage to present on its website was the use of Fan-out Wafer Level Packaging or FOWLP, and the Exynos 2400 is the first smartphone SoC from the Korean giant to flaunt this type of packaging. Here are all the advantages that come with it.
FOWLP also increases heat resistance while also reducing the Exynos 2400 package size to improve heat transfer
Samsung’s Fan-out Wafer Level Packaging helps the Exynos 2400 sport additional I/O connections, allowing for electrical signals to pass through quickly while also introducing heat management improvements thanks to a smaller package area. In short, whichever smartphone the Exynos 2400 is featured in can run for extended periods without overheating. Samsung claims that using FOWLP technology helps increase heat resistance by 23 percent, leading to an 8 percent increase in multi-core performance.
The FOWLP technology is likely what allowed the Exynos 2400 to showcase an impressive showing in the latest 3DMark Wild Life Extreme Stress Test results, where the SoC not only obtained twice the score of its predecessor, the Exynos 2200 but also matched Apple’s A17 Pro. Of course, there are other ways to improve the thermal efficiency of a smartphone chipset, such as using a vapor chamber. Luckily, all of Samsung’s Galaxy S24 models ship with such a cooler, aiding in keeping the temperatures low.
If Samsung has adopted FOWLP technology for the Exynos 2400, it is possible that the same packaging will be used for the Tensor G4, which is Google’s chipset that will reportedly be used in the upcoming Pixel 9 and Pixel 9 Pro later this year. Looking at the Tensor G3’s horrific overheating results, an advanced packaging method for the Tensor G4 could prove useful in keeping those temperatures as low as possible, and with Google said to employ Samsung’s foundry for another year, we could see FOWLP technology adopted here.
News Source: Samsung
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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