60%
Plausible
Apple's exacting standards for its upcoming foldable, dubbed the iPhone Ultra, are now apparently running headlong into the realities of mass-producing such an intricate device on an iPhone-level scale, with the latest tidbit focusing on the Printed Circuit Board (PCB) as the most recent production-related irritant.
The ongoing difficulties in mounting components onto the iPhone Ultra's PCB means that Apple might be forced to delay the launch of its first foldable, unless a solution is found swiftly
The Weibo-based tipster Fixed Focus Digital has just penned a new post, disclosing:
"Exclusive news about Apple's foldable phones. Through supply chain channels, we've learned that Apple isn't facing manufacturing difficulties as some have speculated.
Instead, they're encountering challenges in surface-mount technology (SMT), a pre-assembly process, causing production capacity to be limited, which is not a optimistic outlook…"
Do note that Surface-Mount Technology (SMT) allows for the placement of electronic components directly onto the surface of a PCB. Instead of leveraging thin wires to connect each individual component to the PCB, the technology places all relevant components onto the board's connection pads, where a solder paste then forms a mechanical and electrical connection between the components and the PCB when cured via the application of heat.
As per the latest tidbit, it appears Apple is encountering problems in applying the SMT process to the iPhone Ultra's PCB. In what is a positive development, however, Fixed Focus Digital has directly negated previous reports that had suggested Apple was encountering difficulties related to the intricate hinge mechanism of the foldable iPhone, replete with worrying "rattling" noises that supposedly emanated when the hinge was rotated to open and close the foldable.
What we know so far
To eliminate the dreaded crease problem, Apple is reportedly mulling sandwiching the actual display layer between a dual layer of UTG/UFG (Ultra-Thin Glass/Ultra-Thin Flexible Glass) to prevent the mechanical wear-and-tear from repeated contact with the hinge and to better distribute the stress during the folding process. What's more, this Ultra-Thin Glass (UTG) is likely to sport variable thickness, with the folding area rendered thinner than the rest of the display to decrease a buildup of stress in that area.
Next, to stabilize the display's neutral layer and prevent any gradual misalignment, Apple might use a special type of glue - Optically Clear Adhesive (OCA) - that remains malleable during slow bending, thereby reducing stress, while also sporting micro-fill properties to fill any microscopic cracks within the display.
Apple will also reportedly apply a color filter - called the CoE (Color Filter on Encapsulation) - onto the protective encapsulation layer of the iPhone Ultra's OLED panel, rendering the resulting displays thinner, lighter, and much more efficient
Under a CoE regime, the more conventional, thick circular polarizer layer is replaced with a thinner, directly deposited color filter layer. When combined with a black pixel definition layer (PDL), the combo results in significantly higher light transmittance and reduced power consumption. Of course, for a foldable, thinner displays result in markedly reduced stress, which improves longevity and allows for a smaller folding radius. Together, these innovations might reduce the depth of the crease on the iPhone Ultra to a minuscule 0.15mm.
About the author: Writing is my one incontrovertible passion. Over the past six years, he has authored over 2,200 distinct articles on financial and tech-related topics, spanning nearly 1 million words. And he has been a member of Wcctech mobile team since 2025. As an alumnus of the University of Toronto, Rotman Commerce Program, I bring nuance, in-depth knowledge, and a unique perspective to every topic that I cover. When I'm not writing, I'm traveling the world, exploring hidden confectionaries and restaurants as an aspiring food connoisseur.
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