Apple To Shift From InFO To Wafer-Level Multi-Chip Module Packaging For The iPhone 18’s A20 SoC In 2026, Reducing Unnecessary Production Costs As It Moves To TSMC’s 2nm Process While Boosting Efficiency & Yields

The A20 and the A20 Pro will potentially be Apple’s first 2nm chipsets that will be found in the iPhone 18 series, with the company jumping to the newer lithography thanks to TSMC’s continued efforts. Unfortunately, this shift will not be cheap, as each wafer manufactured using the cutting-edge process is estimated to cost $30,000, making the Cupertino giant one of the few names that will jump on the 2nm bandwagon. However, according to one analyst, the company will be looking at other packaging technologies to improve the chipset’s attributes and lower costs, with the A20 expected to gravitate from InFO (Integrated Fan-Out) packaging to Multi-Chip Module Packaging (WMCM) in 2026.

The same WMCM packaging has been explored on several occasions, but the iPhone 18’s A20 will likely be the first to transition from InFO

The traditional InFO packaging technology could be on its way out in favor of WMCM, as Apple looks to improve cost efficiency and its A20’s capabilities, according to TF International Securities’ analyst Ming-Chi Kuo. Earlier this year, TSMC introduced its CyberShuttle service to help its partners reduce the cost of their chips by sharing the same test wafer, but it appears that Apple has been exploring another technique. Based on the details from the Medium post, the WMCM packaging will employ MUF, or Molding Underfill, which integrates the underfill and molding processes.

This technique helps to reduce material consumption while improving yields and efficiency. Even though TSMC’s yields during its 2nm trial production run were estimated at 60 percent, there is no telling what those numbers will be when the semiconductor boosts its manufacturing to 60,000 monthly wafers. Since TSMC may not give Apple special treatment for defective wafers, the iPhone maker will use other alternatives to reduce its chipset expenditure.

In addition to WMCM packaging, Apple has also been reported to shift to SoIC, or System on Integrated Chips, which combines two advanced chips stacked directly on top of each other. This process allows for ultra-dense connections between the stacked chips, resulting in reduced latency, increased performance, and boosted efficiency. Unfortunately, Apple might keep this technology limited to its M5 family of chipsets, which are said to be found in the company’s updated 14-inch and 16-inch MacBook Pro lineup.

News Source: Ming-Chi Kuo

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