AMD’s Instinct MI450 Reportedly Secures A Major AI Customer

Apr 17, 2026 at 12:55am EDT
AMD Has Begun Sampling MI450 GPUs & Also Engaged With Customers On MI500, Largest AI Deployments Are For Inference

Recent chatter suggests that AMD has secured a major AI customer deal with its upcoming Instinct MI450 GPU accelerators.

Supply Constraints Push Anthropic To Sign A Major Deal With AMD, Will Be Leveraging Next-Gen Instinct MI450 GPUs

Given the tightness surrounding the industry's supply chain, major AI players are looking to fulfill their infrastructure requirements from various firms.

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AMD is aware of this opportunity and has already hinted at multiple "Open-AI" scale customers that are lined up for its existing and upcoming Instinct AI accelerators. The company has OpenAI & META already onboard, with the latter signing a 6 Gigawatt commitment, which includes multiple generations of Instinct accelerators.

Now, AMD is eyeing another major AI customer win, which happens to be Anthropic. According to rumors, the AI firm plans to incorporate the next-gen Instinct MI450 accelerators into its servers, pushing capabilities to new heights.

This year, AMD will launch its Instinct MI400 series AI accelerators in MI450X and MI430X flavors. The new lineup will be based on the CDNA 5 architecture and offers:

The official metrics list the MI400 as a 40 PFLOP (FP4) & 20 PFLOP (FP8) product, which doubles the compute capability of the MI350 series, which is a hot product for AI data centers.

In addition to the compute capability, AMD is also going to leverage HBM4 memory for its Instinct MI400 series. The new chip will offer a 50% memory capacity uplift from 288GB HBM3e to 432GB HBM4. The HBM4 standard will offer a massive 19.6 TB/s bandwidth, more than double that of the 8 TB/s for the MI350 series. The GPU will also feature a 300 GB/s scale-out bandwidth/per GPU, so some big things are coming in the next generation of Instinct.

AMD has positioned its Instinct MI400 GPUs against NVIDIA's Vera Rubin, and the high-level comparison is listed below:

If this deal goes the way the rumor suggests, then AMD is in for a big win and another major win for the Helios AI racks. And it goes on to show just how constrained the semiconductor industry is right now. The more interesting stuff is that this news comes at a time when Anthropic has signed a strategic alliance with Google and Broadcom.

This gives Anthropic access to multiple AI solutions. It is already using NVIDIA's GPUs, Amazon Trainum, and with the new Broadcom/Google alliance, it will have access to TPUs too. There's another part to this story, too. Getting close to Broadcom, who have experience in ASICs, might give Anthropic a chance to start investing in its own custom silicon for its Claude models. That is a story for another day.

We have signed a new agreement with Google and Broadcom for multiple gigawatts of next-generation TPU capacity that we expect to come online starting in 2027. This significant expansion of our compute infrastructure will power our frontier Claude models and help us serve extraordinary demand from customers worldwide.

via Anthropic

But for now, AMD has showcased why it is a key player in the AI industry, and why its products are a solid framework for rack-scale AI ecosystems.

Today, AMD and representatives of the French government announced plans to deepen collaboration in support of France’s National Strategy for AI, aimed at accelerating local AI innovation, expanding access to open and advanced compute resources for the local AI ecosystem and strengthening France’s position in the global AI landscape.

via AMD

The company has also collaborated with the French Government in accelerating and supporting their growing AI needs, along with Alice Recoque, France's first exascale supercomputer, and will enable France's AI community to harness AMD’s broad portfolio of high-performance computing platforms and open software ecosystem.

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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