AMD Preps EXPO 1.20 Memory Technology For Enhanced DDR5 OC Profiles, CUDIMM Support Coming To AM5 Next Year

AMD is working on its next-gen EXPO 1.20 memory technology, which will support enhanced DDR5 memory OC profiles and more.

AMD EXPO 1.20 Memory Technology For Enhanced DDR5 OC Profiles Spotted In HWiNFO v8.35, CUDIMM Support On AM5 Planned For 2026 Too

Back when AMD announced its AM5 platform, the company also released its EXPO DDR5 memory technology, which essentially provides a list of overclocked memory profiles designed for Ryzen processors.

This technology was designed to replace the older AMP (AMD Memory Profile) technology and XMP, which were often associated with Intel platforms. While AM5 supports both EXPO and XMP profiles, the EXPO technology offers a refined set of one-click OC profiles that are tuned for AM5 platforms.

Now, as per the latest Beta version of HWiNFO, it looks like AMD is preparing an update to its EXPO technology with a new version "1.20". No specifics are mentioned yet, but this could be introduced in refreshed AM5 motherboards, offering even better DDR5 memory support than what's capable now.

HWiNFO v8.35-5890 Beta available.

Changes:

• Enhanced sensor monitoring on Colorful B650, B850, X870, Z790, Z890 series.
• Enhanced support of Nova Lake-H/HX.
• Fixed a bug when browsing search results in the main window.
• Increased ETW buffers for PresentMon.
• Added Arrow Lake Refresh and Panther Lake SKUs.
• Added fan speed monitoring for ASUS Vivobook Pro 15 N6506.
• Improved the distinction between Nuvoton NCT6799D/NCT6796D-S/NCT5584D.
• Added the integrated Stress Test tool.
• Added AMD Radeon AI PRO R9700S and R9600D.
• Moved integrated Intel GPU sensor values to a dedicated sensor.
• Added dedicated AMD and Qualcomm NPU sensors.
• Added DDR5 sensor for LPCAMM2 modules.
• Fixed Arrow Lake-S 4P+4E and 6P+12E support.
• Fixed reporting secondary NVIDIA GPU as fake when disabled.
• Added more SOCAMM2 details.
• Added AMD EXPO 1.20 support.
• Enhanced Nova Lake telemetry.

AMD's board partners have already tuned AM5 motherboards with the latest AGESA firmware, enabling support for faster DDR5 DIMMs, exceeding 8000 MT/s in certain cases. Even 10,000 MT/s speeds are supported on certain OC-specific motherboards when paired with Ryzen 8000G APUs, thanks to their solid IMC (Integrated Memory Controller).

We don't expect AMD to make big changes in its upcoming Ryzen 9000 "Zen 5" refreshes, which are mostly going to reuse the same CCD and IOD configuration, but it looks like these new profiles will be essential for tuners on the new Ryzen APU family, reportedly codenamed Ryzen 9000G. These chips, based on the "Strix" family, will feature a monolithic design, offering Zen 5 CPU cores, and RDNA 3.5 iGPUs, along with a tuned XDNA 2 NPU. These APUs are expected in the first half of 2026.

But there's more, although not a part of the EXPO 1.20 feature set, we have been told by board makers that AMD has been actively working towards adding CUDIMM support for its future CPU platforms. The same AM5 platform will be retained, but CUDIMM support is expected to be introduced with the Zen 6-based Ryzen family in the second half of 2026.

This will enable memory feature parity with Intel's desktop lineup, which has supported CUDIMM memory since last year. Intel is already working to enable even higher CUDIMM support on its Arrow Lake Refresh lineup and will further heighten the capabilities when its next-gen desktop platform, Nova Lake-S, lands in the second half of 2026.

Although these technologies will pave the way for better DDR5 support on both Intel and AMD desktop platforms, the pricing remains a concern for hardware enthusiasts due to shortages that are expected to last many years due to the AI craze, which will hike DIMM prices by 2x-3x rates. So a CUDIMM that was going for $400-$500 US a few months ago is now priced at around $800-$1000 US, and further price hikes are expected throughout 2026.

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