Apple’s “go to” chipset packaging for its A-series of chipsets was InFO-PoP (Integrated Fan-Out Package-on-Package), which had its uses, but in the age of artificial intelligence, the technology was quickly becoming dated and introducing a ton of limitations, including thermal problems for running on-device AI operations.
Thankfully, if there was one positive outcome for the AI boom, it’s that companies like Apple have been encouraged to research and develop newer packaging, as it has done with the A20 Pro and its Wafer-Level Multi-Chip Module Packaging (WMCM). Of course, that’s what a tipster claims and may not be the complete reality.
The new WMCM process eliminates the thermal limitations for the A20 Pro while also bringing bandwidth improvements, making the SoC ideal for on-device AI
The problem with PoP technology is that with the DRAM stacked on top of the silicon die, both components will reach their thermal limits sooner, especially when running tasks that stress both the SoC and memory. Even with a vapor chamber, this packaging will eventually prove ineffective for running on-device AI, which also taxes both components.
According to Weibo’s Fixed-focus digital cameras, AI propelled Apple to act on transitioning from PoP to WMCM, since the former isn’t able to handle thermal issues well and is limited in handling larger data volumes. A previous A20 Pro logic board leak revealed that the DRAM will be kept entirely separate from the chipset die, with a bigger Neural Engine also helping to boost AI performance.
The A20 Pro won’t be thermally choked by the RAM, giving it sufficient thermal headroom, with its temperatures also significantly improving with a larger vapor chamber. The bandwidth bump could also be the result of switching to 96-bit LPDDR6 RAM, but we’ll have to wait and see if Apple is really upgrading from the LPDDR5X standard.
Was AI really the catalyst that Apple needed to change its chipset packaging?
It’s fine for tipsters to make their claims from time to time, but we also have to view these rumors from a logical angle. Regarding AI, Apple is pretty much behind its rivals, and that doesn’t necessarily mean it’s lacking in this area, but it’s because there hasn’t been a solid use case to bring on-device AI to smartphones, making spending billions on this venture a fruitless obligation.
We feel that with the M5 Pro and M5 Max getting packaging changes, Apple may have concluded that the A19 Pro and its PoP had reached the performance limits of the A-series lineup, prompting a much-needed change. If AI was the only encouragement that Apple needed, why is Samsung aggressively bringing packaging improvements to its Exynos 2700? It’s something to think about.
News Source: Fixed-focus digital cameras
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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