TSMC’s 2nm Process is Reportedly Recording 1.5 Times More Tape-Outs Compared To The 3nm Node, Apple, Qualcomm & MediaTek To Make Up A Large Percentage

Jan 7, 2026 at 10:07am EST
TSMC has recorded 1.5x more tape-outs for its 2nm technology compared to the 3nm variant

A bevy of chips mass produced on TSMC’s 2nm process is expected to launch later this year, with MediaTek already having announced the tape-out of its first SoC on the next-generation lithography in 2025. Like the Taiwanese fabless semiconductor firm, several other customers are lined up to place orders on the next-generation process, with fresh details stating that TSMC’s 2nm node has witnessed 1.5 times the number of tape-outs compared to the 3nm technology, indicating just how ravenous the demand is.

New details also mention that TSMC will maintain an unyielding 95 percent market share in the AI accelerator market, which has taken the company’s revenue to new heights

The details were posted by @jukan05, who states that the unprecedented demand for TSMC’s 2nm node will allow it to obtain an impressive 95 percent market share in the AI accelerator market. Even Intel, which was previously reported to leverage its 18A technology for the Panther Lake Core Ultra Series 3, is also said to explore TSMC’s N2 process for a number of products. Due to the AI boom, the monthly wafer manufacturing target on the aforementioned lithography is estimated to reach a mammoth 140,000 units by the end of 2026.

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If that wasn’t impressive enough, TSMC’s 2nm revenue is reported to surpass the combined revenue of the 3nm and 5nm processes by the third quarter of 2026, making it another indicator of just how rapidly the technology is being adopted. Apple, which was TSMC’s biggest customer in 2024, is said to have secured more than half of the initial capacity, with the majority of wafers likely being utilized for the A20 and A20 Pro, which will power the iPhone 18 series, followed by the M6 that’s expected to be incorporated in the OLED MacBook Pro.

Qualcomm and MediaTek are rumored to keep pace with their chipset rival, with the tipster Smart Chip Insider predicting that all three companies will announce their 2nm SoCs in the same month. However, if Apple has secured more than half of the initial capacity, how will Qualcomm and MediaTek launch their first 2nm silicon? Well, it just so happens that TSMC has an improved iteration of its N2 node called N2P, and even though it offers a minor improvement, it should give Apple’s rivals the advantage of targeting higher CPU frequencies and possess adequate shipments for their customers.

The tipster has also shared a note from Morgan Stanley stating that, despite TSMC possessing the most advanced foundry, Apple is still contemplating the use of Intel Foundry Services (IFS) for its M-series of chipsets. The Cupertino giant has been reported to utilize the 18A process in the future, but this will likely be for the low-end models found in affordable Macs. Given TSMC’s long history of reliability and access to cutting-edge nodes, we doubt any foundry will surpass it for several years.

News Source: @jukan05

About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.

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