Google’s Pixel 9 series, sporting the new and improved Tensor G4, has been out for a while, but early performance leaks show that the chipset continues to lag severely behind the competition. This attribute is put on display during a 3DMark Wild Life Extreme test, where the Pixel 9 Pro is put through its paces. Sadly, the Tensor G4 is barely faster than the Tensor G3 and trails behind the significantly older Snapdragon 8 Gen 1. Thankfully, the latest SoC flaunts much better power efficiency, as you will find out soon.
Snapdragon 8 Gen 1 consumes 48.2 percent more power than the Tensor G4, hinting how Samsung’s improved 4nm process did the trick
An in-depth smartphone reviewer who goes by the name Golden Reviewer posted a performance chart, showing various smartphone and tablet chipsets that were run under 3DMark Wild Life Extreme. As you can tell, the latest entrant is the Tensor G4, and it obtains a score of 2,618, making it slightly higher than the Tensor G3’s 2,445. The benchmark employs a combination of tests that stress both the CPU and GPU, so the Tensor G4 likely attained a higher score thanks to the improved CPU cluster.
We doubt that the Tensor G4’s GPU made any difference because it remains unchanged from the Tensor G3. While the disappointing aspect of these results is that Google’s latest silicon is slower than the Snapdragon 8 Gen 1, a chipset that launched in 2021, there is also a different side of the coin; power efficiency. Thanks to Samsung’s improved 4nm process, the Tensor G4 effortlessly beats the Tensor G3 and Snapdragon 8 Gen 1 and obtains a high ‘performance per watt’ score.
In fact, the Tensor G4 displays better efficiency metrics than the Snapdragon 8+ Gen 1, but you also have to keep in mind the performance disparity between these two. A Google executive had previously stated that its latest SoC was not designed to win any benchmarking awards and that it was made for specific tasks that users would benefit from. It is unclear if this statement was made to encourage potential Pixel 9 Pro buyers to ignore the fact that synthetic benchmarks are not everything.
However, for 2025, we look forward to the Tensor G5’s release, as it is said to be mass produced on TSMC’s second-generation 3nm process and will employ InFO-POP packaging, which reduces die size and improves power efficiency.
News Source: Golden Reviewer
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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