SK Hynix is now mass-producing SOCAMM2 memory with up to 192 GB capacities for NVIDIA & next-gen AI Data Centers.
Prepped For NVIDIA's Vera Rubin & AI Data Centers, SK Hynix Begins Mass Production of SOCAMM2 Memory With 192 GB Capacities
At CES 2026, SK Hynix announced that it had delivered its next-gen memory solutions, such as SOCAMM2, to NVIDIA for its upcoming AI data center solutions. Now, four months later, SK Hynix is announcing that it has begun mass production of the memory, and it will be utilized by NVIDIA's next-gen platform for AI.
NVIDIA will be utilizing SOCAMM2 from all three memory manufacturers, SK Hynix, Samsung & Micron for a diversified supply chain to keep up with the demand as Vera Rubin takes center stage in the Agentic AI era.
Press Release: SK hynix announced today that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10-nanometer technology) LPDDR5X low-power DRAM.
SK hynix emphasized that the 1cnm-based SOCAMM2 product that is now in mass production delivers more than double the bandwidth with over 75% improved power efficiency compared to conventional RDIMM, providing an optimized solution for high-performance AI operations.
In particular, the company noted that its SOCAMM2 products are designed for the NVIDIA Vera Rubin platform.
“By supplying the 192GB SOCAMM2, SK hynix has established a new standard for AI memory performance” Justin Kim, President & Head of AI Infra (CMO, Chief Marketing Officer) at SK hynix said. “We will solidify our position as the most trusted AI memory solution provider, through close collaboration with our global AI customers.
SK hynix expects the new SOCAMM2 product to fundamentally resolve the memory bottlenecks encountered during the training and inference of large language models (LLM) with hundreds of billions of parameters, thereby playing a pivotal role in dramatically accelerating the processing speed of the overall system.
The company stated that with the AI market shifting focus from inference to training, SOCAMM2 is gaining significant attention as a next-generation memory solution capable of operating LLMs with low power consumption. To meet the demands of its global Cloud Service Provider (CSP) customers, SK hynix has not only been providing a supply portfolio, but also stabilized its mass production system early on.
SOCAMM2 is a module that adapts low-power memory – which was previously used mainly in mobile products like smartphones – for server environments. It is designed to be a primary memory solution for next-generation AI servers.
SOCAMM2 (Small Outline Compression Attached Memory Module 2): An AI server–optimized memory module based on LPDDR. It offers a slim form factor and high scalability, while its compression connector enhances signal integrity and allows for easy module replacement
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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