SK hynix has showcased its next-gen memory solutions for AI, featuring 48 GB HBM4, SOCAMM2, LPDDR6, and much more for future platforms.
SK hynix Empowers Next-Gen AI Platforms With Blazing Fast 48 GB HBM4, LPDDR6 & SOCAMM2 Memory
Press Release: SK hynix announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next-generation AI memory solution at CES 2026, in Las Vegas from January 6 to 9 (local time).
The company showcases a 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of a 12-layer HBM4 product with 36GB, which demonstrated the industry’s fastest speed of 11.7Gbps, and is under development, aligned with customers’ schedules.
12-layer HBM3E product with 36GB, which will drive the market this year, will also be presented. In particular, the company will jointly exhibit GPU modules that have adopted HBM3E for AI servers with customer and demonstrate its role within AI systems.
In addition to HBM, the company plans to showcase SOCAMM2, a low-power memory module specialized for AI servers, to demonstrate the competitiveness of its diverse product portfolio in response to the rapidly growing demand for AI servers.
Also, SK hynix will exhibit its lineup of conventional memory products optimized for AI, demonstrating its technological leadership across the market. The company will present its LPDDR6, optimized for on-device AI, offering significantly improved data processing speed and power efficiency compared to previous generations.
In NAND flash, the company will present its 321-layer 2Tb QLC product, optimized for ultra-high capacity eSSDs, as demand surges from rapid expansion of AI data centers. With best-in-industry integration, this product significantly improves power efficiency and performance compared to previous-generation QLC products, making it particularly advantageous in AI data center environments where lower power consumption is needed.
For cHBM(Custom HBM), due to specific interest from customers, a large-scale mock-up has been prepared to allow visitors to visually sight its innovative structure. As the competition of the AI market shifts from mere performance to inference efficiency and cost optimization, this visualizes a new design approach that integrates part of computation and control functions into HBM which was handled by conventional GPU or ASIC in the past.
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
Follow Wccftech on Google to get more of our news coverage in your feeds.
