Samsung looks to excel in DRAM standards, as the firm is preparing "3D DRAM" that aims to stack higher cell layers for big capacity boost.
Samsung's Next-Gen 3D DRAM Could Potentially Take Chip Capacities Up To 100 GB, Providing High-Performance
With the DRAM industry in dire need of innovation, the Korean giant has stepped in with its new concepts to attract consumer and clientele interest. At the International Memory Workshop (IMW) 2024 event held in Seoul, South Korea, Samsung Electronics Vice President Lee Si-woo showcased the new 3D DRAM technology, claiming that with rapidly growing markets, especially the AI segment, the need for advanced DRAM tech has become vital more than ever.
Industrial developments such as hyperscaler AI and on-demand AI require a lot of memory processing ability. On the other hand, the microprocessing technology of existing DRAM is limited. As we get closer, new innovations are expected to occur in the structure of cells (units where data is stored).
- Samsung Electronics Vice President via ZDNet Korea
Expanding on the 3D DRAM architecture, it is said that Samsung has managed to significantly reduce the cell area through both DRAM integration and performance, which will witness a massive increase.
The Korean giant has implemented a renowned cell structure called the "4F Square", but the DRAM transistors are mounted vertically, which is called the VCT (Vertical Channel Transistors) technique. Through changes in cell structure by combining both 4F Square and VCT, Samsung aims at stacking as many cell layers, and with the 16-layer target, the firm could very well witness huge memory capacity and performance boost.
With the DRAM markets witnessing a potential economic upturn due to the AI hype and consumer demand, it's exciting to see such developments occurring in the markets since it not only leads to innovation but increases market competition as well, ultimately favoring an average consumer. However, 3D DRAM is still a concept for now and Samsung themselves say that the standard involves complex manufacturing techniques, which leads to high production prices.
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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