NVIDIA's next Blackwell chip for China's AI markets, the B30A, is set to feature HBM3E memory, with performance uplifts driven by architectural advancements.
NVIDIA's B30A Chip Could Feature Serious Upgrades Over the H20, Credits To The Chiplet Configuration
Recently, there have been speculations about the next step NVIDIA would take for the Chinese AI markets. It needs to come up with an effective solution soon to maintain market dominance. Now, in an analysis by GF Securities, it is revealed that the B30A chip is the next candidate for NVIDIA's flagship offering in China, and compared to the H20 AI chip, we are looking at similar specifications, such as 8-Hi HBM3E, TSMC's N4P process and the presence of NVLink interconnect, however, a huge chunk of performance boost will be driven by the Blackwell architecture.
The B30 AI chip will be a dual-die design, which is a significant difference from the H20 AI chip, which has employed a monolithic design. With this, NVIDIA will likely put the B30A chip on par with the B200/B300 in terms of the chiplet configuration. Based on previous estimates, the chip will feature half the specs of the B300 chip, which is validated by GF Securities as well. We are looking at 141 GB HBM3E 8-HI, along with TSMC's N4P node and NVLink with 900 GB/s connection, similar to the H20 configuration.
NVIDIA plans to gain an edge with the dual-die design over the H20. Considering the big difference in performance we saw between the Hopper and Blackwell generations, the B30A chip is likely to be a popular solution among Chinese customers. GF Securities claims that the Blackwell chip for China can debut by Q4 2025, which means that Jensen and his team would likely need to push towards regulatory approval from the Trump administration in the coming weeks.
It will be interesting to see what specifications are finalized for the B30A chip, or the next solution for China from NVIDIA, given that right now, Chinese AI firms are pushing to replace NVIDIA's tech stack, which means that Team Green needs to speed up its way into accessing the Chinese markets with a Blackwell solution.
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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