Loongson Develops 32+ Core Chiplets For Its Next-Gen 3D7000 CPUs, Based on Sub-10nm Process Technology & Aiming 2027 Release

Nov 17, 2025 at 10:45am EST
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Loongson has started developing its next-gen "3D7000" CPU family, which will feature over 32 core chiplets.

Loongson To Pack Massive 32+ Core Chiplets In Its Next-Gen 3D7000 Server CPUs, Aiming 2027 Release

Chinese chip maker Loongson has started the development of its next-gen server CPU family. The lineup, codenamed 3D7000 series, is expected to be released in 2027 and will leverage a sub-10nm process node.

Related Story Loongson Targets Intel 12th Gen and Radeon RX 550 Performance With 3B6600 CPUs and 9A1000 GPUs Launching Next Year

As for the predecessor, Loongson has already unveiled its 3C60000 processors, which leverage a 1X nm node, likely 12nm. These chips feature 16-core chiplets and scale up to 64 cores with quad-chiplet models, & up to 300W TDPs. The company also offers its workstation-oriented 3D5000 family with up to 32 cores at 2.0 GHz.

"We have already started IP design work for X-nanometer advanced processes, and we will begin developing technologies such as phase-locked loops, multi-port register files, DDR5-PHY, and PCIe5-PHY."

Machine Translated via Loongson

With the 3D7000 CPU family, Loongson is going to leverage a sub-10nm advanced process technology and will utilize chiplets with 32 or more cores. That's quite a big deal as it doubles the core count per chiplet. The company states that they have already started the IP design work for the Xnm advanced process technology and will include modern technology supports such as DDR5 and PCIe 5.0.

32+ core CPU chiplets will be an amazing feat for Loongson. We know that AMD's next-gen Zen 6 core architecture will feature two CCDs, a 12-core "classic" and a 32-core "dense" variant. These chips will be arriving next year for the server segment. As per Loongson, 2027 seems to be the introduction timeline, and we can realistically expect deployment of these chips by 2028. No other details are known about the Loongson 3D7000 CPUs, such as architecture, SKUs, clocks, etc.

In addition to the Loongson 3D7000 server CPUs, the company also confirmed that its 9A1000 discrete GPU, an entry-level design for the AI PC segment, will be ready in the coming year. The company is enabling driver support on the Windows OS, and it was recently submitted for tape out. Both of these products are expected to play a major part in the Chinese domestic market, which has increased its reliance on domestically produced products instead of relying on hardware from offshore and US-based brands.

News Source: MyDrivers

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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