Lian Li has unveiled its LANCOOL 207 ATX case, featuring a revamped overall case layout with a unique PSU placement at the very front of the case.
Lian Li Decides To Innovate The Gaming Case Segment By Offering The LANCOOL 207, Featuring Distinct Layout Changes
[Press Release]: LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, launches the latest addition to its LANCOOL series with the LANCOOL 207. This 45.5L M-ATX-sized case, despite its compact size, offers ATX compatibility. It fits a 360mm radiator on top, ATX motherboards, ATX PSUs (up to 160mm long), and GPUs up to 375mm long, all within a space-saving form factor.
The case has pre-installed 2 x 140mm ARGB high airflow fans at the front and 2 x 120mm PWM fans at the bottom for optimal cooling. Large mesh panels on the front, top, and bottom improve ventilation. The offset motherboard position maximizes cooling for the GPU, and the front PSU installation aids in cable management and provides tidy organization. The LANCOOL 207 is available in black and white at an MSRP of $79.99 and $84.99 respectively.
Redesigned Motherboard Tray Layout
The LANCOOL 207 achieves a smaller form factor without compromising compatibility, thanks to its redesigned motherboard tray layout and front PSU placement. Moving the PSU to the front frees up space below the motherboard, allowing it to be lowered slightly. This creates clearance at the top for thick fans and radiators.
The motherboard tray is recessed closer to the right side panel, providing additional width clearance for 140mm fan support without expanding the case’s width. The LANCOOL 207 supports GPUs up to 375mm long and includes a pre-installed, adjustable anti-sag bracket that can be repositioned vertically and horizontally.
Unique PSU Installation
The LANCOOL 207 PSU is located at the front of the case using an included PSU adapter cable. The orientation of the PSU installation has been adjusted so that the connector ports face outwards, making it easier to plug in cables. Cable management has been enhanced by moving it towards the front of the case, reducing its width and improving organization. Additionally, the case comes with three dual-layered fasteners for neat and efficient cable management.
Enhanced Airflow Design
Featuring large mesh panels on the front, top, and bottom, the LANCOOL 207 delivers excellent ventilation. Its shorter depth directs airflow from the front top fan to the CPU, while an offset motherboard allows two bottom fans to cool the GPU efficiently.
The case includes two pre-installed 30mm thick 140mm ARGB and PWM fans with infinity mirrors at the front capable of reaching up to 1900RPM and providing a massive airflow of 109.3 CFM, and two 120mm PWM fans at the bottom featuring an 11-blade design, offering powerful cooling with speeds up to 1950 RPM.
The LANCOOL 207 is now available at Amazon:
Specifications
| Model | Lian Li LANCOOL 207 |
| Case Type | Tower Chassis |
| Dimensions | (D) 455.6 x (W) 219 x (H) 456mm |
| Color | Black / White |
| Material | Steel 4.0mm tempered glass Aluminum |
| Motherboard Support | ATX (Width = 240mm) MICRO-ATX MINI-ITX |
| Expansion Slot | 7 |
| Storage | 2 x 3.5ʹʹ HDD or 2.5ʹʹ SSD |
| GPU Length Clearance | 410mm(Max) |
| CPU Cooler Height Clearance | 167mm (Max.) |
| PSU | ATX (Under 160mm) |
| Fan Support | (Front) 2 x 140mm (Pre-installed) (Top) 3 x 120mm / 2 x 140mm (Bottom) 2 x 120mm (Pre-installed) (Rear)1 x 120mm |
| Radiator Support | (Top) 360 / 280 / 240 |
| I/O PORTS | 1 x Power Button 2 x USB 3.0 1 x USB type C 1 x Audio |
| Dust Filters | 1 x Bottom |
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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