At 5.6mm in thickness, the iPhone Air has a congested design that would make it difficult for its exceptionally powerful components to breathe properly, so Apple’s engineers really took ‘thinking outside of the box’ to a whole new level and incorporated all the components inside that camera bump, or at least that is what we were led to believe. According to the latest motherboard design leak, it appears that only the circuit board side housing the A19 Pro is present in that particular area, while the rest of the PCB has had to share the space with the battery.
The shape of the iPhone Air’s motherboard is not completely rectangular, making it impossible for it to be placed in that camera bump alone
The schematics and labeling of the iPhone Air logic board were shared by tipster ShrimpApplePro, with the image showing that a sizable space has been occupied by the A19 Pro. The logic board design is a ‘sandwiched’ one, with components stacked on both sides to help conserve space. We also noticed the C1X 5G modem and N1 wireless networking chip present on either side of the PCB, with Apple successfully conserving space by switching to its in-house silicon.
However, despite this approach, the entire PCB cannot be outfitted in the camera bump, as some of that space needs to be allocated for the rest of the chassis. On the X thread, @BasQuxFoo was kind enough to provide an illustration of how the iPhone Air’s logic board would look when inside the device, and you can clearly see in the image below that just the A19 Pro is present in the camera bump area.
Regardless, we should not be surprised if, in a couple of generations, Apple successfully shrinks future logic boards and incorporates them in only the camera cluster, with the remaining space occupied by a larger battery to deliver record runtimes. It is important to note that we should wait for the actual teardowns from reputable outlets to come through to confirm if this is the exact layout of the iPhone Air’s logic board, and, as always, we will return with more updates.
News Source: ShrimpApplePro
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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