Intel Foundry may soon see a breakthrough for its 18A-P process, as a prominent analyst predicts that Apple will adopt the node for the lowest-end MacBook and iPad chips.
Apple is Expected To Be a Significant External Customer of Intel's 18A-P Process, Building On the 'Made in USA' Narrative
Intel has been pursuing external customers for its foundry division, particularly in processes such as the 18A and its derivatives. We know that several external clients are rumored to be collaborating with Intel on PDK sampling for 18A, and it appears that Apple will be a major customer. According to an analysis by prominent analyst Ming-Chi Kuo, the Cupertino giant is reportedly on track to adopt Intel's 18A-P process for its MacBook and iPad chips, based on optimism surrounding early PDK kits of the node.
Apple previously signed an NDA with Intel and obtained the advanced-node 18AP PDK 0.9.1GA. The key simulation and research projects (such as PPA) are tracking in line with expectations, and Apple is now waiting for Intel to release PDK 1.0/1.1, currently scheduled for 1Q26.
Apple's plan is for Intel to begin shipping its lowest-end M processor, utilizing the 18AP advanced node, as early as 2Q–3Q27, but the actual timeline remains contingent on development progress following the receipt of PDK 1.0/1.1.
Of course, we do know that external adoption by Apple isn't '100% confirmed' as for now, it depends on how the later stages of PDK sampling turn out for Intel. For those unaware, the 18A-P process is a derivative announced by Intel at the Direct Connect 2025, the company's first node to support Foveros Direct 3D hybrid bonding. The hybrid bonding approach will allow Intel to stack multiple chiplets through TSVs, and it is claimed that the Foveros Direct 3D bonding technology will use a pitch of less than 5 microns.
The reason why 18A-P makes sense for Apple's future M-series SoCs is that the process is fine-tuned for a variety of power/voltage regimes, with tuned threshold voltages for better power-efficiency trade-offs, which aligns with Apple's ecosystem of designing high-performing chips with optimal power ratings. It is claimed that Apple has signed an 'exclusive' NDA with Intel around 18A-P, which means that the tech giant could turn out to be a crucial customer for the process alone.
Ming estimates that Apple's lowest-end M-series chips for MacBook and iPad could scale up to 15–20 million units by 2027, and given that the firm does manage to utilize Intel Foundry, this could turn out to be a massive prospect. More importantly, the integration of IFS by Apple also stems from the fact that the company has been a supporter of American manufacturing. While the Cupertino giant will remain a key customer of TSMC, diversification into Intel is a high possibility to meet "supply-chain management requirements."
The 18A-P is undoubtedly an attractive offering for fabless companies that focus more on power efficiency, and by the looks of it, Apple could lead the adoption of the node. However, for now, it's essential to note that this collaboration is contingent upon how PDK sampling turns out.
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