Intel's plans to integrate glass substrates into advanced packaging technologies aren't set to phase out just yet, as the company showcases a key innovation.
Intel's Newest EMIB + Glass Substrate Core Technology Allows a Multi-Chiplet GPU Configuration For Future HPC Chips
When we talk about the future of advanced packaging, one key metric is the use of glass substrates to replace organic materials used in traditional implementations. We'll talk about the benefits of glass substrates a bit later, but for now, Intel Foundry has showcased a "Thick Core" glass substrate integrated within their EMIB packaging technology at this year's NEPCON Japan, and Team Blue claims it to be a one-of-a-kind implementation, claiming that it is positioned for data center applications.
The reason this development is essential is that rumors surfaced that Intel had scrapped plans for glass substrates, especially after the departure of key employees. It's important to note that Intel has been one of the "pioneers" in glass substrates, initiating work on them much earlier than mainstream fabs, which is why it was expected that the company would have a lead in the technology. However, with the recent situation, it was claimed that glass substrates have taken a backseat, until now, when Intel has shown the very first glass substrate + EMIB implementation.
Team Blue reveals that their approach delivers a 2x reticle size in a 78mm x 77mm package. In terms of the vertical cross-section, you are looking at a 10-2-10 stack-up architecture, with ten RDLs, a two-layer glass core, and ten bottom/build-up layers, and even with such a dense stack, due to the nature of glass, you could still enable dense wiring, which is a key advantage of this solution. Interestingly, Intel has already integrated two EMIB bridges within the package to connect multiple compute dies.
The package's footprint and the clear "No SeWaRe" highlighting indicate that this solution is intended for server-grade products, such as AI accelerators. It won't be wrong to say that the EMIB + glass substrate implementation shown here is vital for scaling up the performance of AI architectures, as glass enables fine connections, better depth-of-field control, and reduced mechanical stress. In short, if you want AI chips to have dozens of chiplets in a single "super-package", Intel's approach is the way to go.
EMIB has attracted significant interest from HPC companies amid production bottlenecks in the advanced packaging supply chain, and Intel appears to be moving swiftly on the opportunity, doubling down on its ambitions with glass substrates. If enablement continues at its current pace, advanced packaging could open a new revenue frontier for Intel Foundry.
About the author: Muhammad Zuhair is a hardware and technology reporter for Wccftech, specializing in the semiconductor industry and the complex interplay between technology, manufacturing, and geopolitics. His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. Zuhair's expertise lies in deconstructing complex topics such as fabrication nodes (e.g., 2nm process), the economic impact of policies like the CHIPS Act, and the strategic development of AI infrastructure from NVIDIA, AMD and Intel.
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