Intel's next-gen Panther Lake-H CPUs for laptops have been spotted with up to 12 Xe cores based on the upcoming Celestial "Xe-LPG" architecture.
Intel Panther Lake High-End Laptop CPUs To Feature 50% More Graphics Cores Based On The Arc Celestial "Xe3-LPG" GPU Architecture
The information comes from within the shipping manifestos spotted by @miktdt and shows the Intel Panther Lake-H CPUs along with possible specifications. These chips should be very early samples since Panther Lake has already been in the fabs since early Q2 and Intel could be receiving and sampling the first chips for early evaluation purposes.
Coming to the details, the Intel Panther Lake CPU here is listed as an "H" SKU which represents the high-end laptop segment. This chip is also listed with 12 Xe cores and a new "GG3-CT" label which could be a reference to the 3rd Generation Arc graphics architecture codenamed Celestial.
What's interesting here is that the Panther Lake-H CPU is listed with 12 Xe cores which are 50% more cores versus the 8 Xe-cores currently featured on Meteor Lake chips and should remain the same on the upcoming Arrow Lake CPUs. Intel's Lunar Lake CPUs are also going to use the next-gen "Xe2-LPG" GPU cores based on the Arc Battlemage architecture.
Intel's Celestial "Xe3-LPG" graphics architecture should be a huge upgrade over current Alchemist & even the upcoming Battlemage GPUs. Having 50% more cores is going to deliver much faster iGPU performance and we can also expect the use of new memory types to help boost the bandwidth. It is expected that 2025 will be the year of the LPDDR6 and faster LPDDR5X standards & that should definitely help.
Last month, Intel confirmed that its Panther Lake CPUs were already in fabs and are on track for a mid-2025 launch. Based on the information we have right now, these chips will utilize the Cougar Cove P-Core architecture and the Skymont E-Core architecture. They will be housing an advanced NPU which will deliver 2x the AI TOPs versus Lunar Lake which itself is expected to offer over 100 platform AI TOPs. Intel is also expected to utilize its Intel 3 process node for the SOC tile while the iGPU tile is expected to be fabricated using an external node from TSMC, most likely N3 or N3.
The IDs for Intel's next-gen Panther Lake CPUs were recently spotted in CoreBoot which pointed out GT3 and GT3 tier graphics chips, more on that here.
Intel Mobility CPU Lineup:
| CPU Family | Panther Lake | Lunar Lake | Arrow Lake | Meteor Lake | Raptor Lake | Alder Lake |
|---|---|---|---|---|---|---|
| Process Node (CPU Tile) | Intel 18A | TSMC N3B | TSMC N3B | Intel 4 | Intel 7 | Intel 7 |
| Process Node (GPU Tile) | TSMC N3E / Intel 3 | TSMC N3B | TSMC 5nm | TSMC 5nm | Intel 7 | Intel 7 |
| CPU Architecture | Hybrid | Hybrid (Dual-Core) | Hybrid (Triple-Core) | Hybrid (Triple-Core) | Hybrid (Dual-Core) | Hybrid (Dual-Core) |
| P-Core Architecture | Cougar Cove | Lion Cove | Lion Cove | Redwood Cove | Raptor Cove | Golden Cove |
| E-Core Architecture | Darkmont | N/A | Skymont | Crestmont | Gracemont | Gracemont |
| LP E-Core Architecture (SOC) | Darkmont | Skymont | Crestmont | Crestmont | N/A | N/A |
| Top Configuration (Compute Tile) | 4+8 (H-Series) | 4+4 (MX Series) | 6+8 (H-Series) 2+8 (U-Series) | 6+8 (H-Series) 2+8 (U-Series) | 6+8 (H-Series) 8+16 (HX-Series) | 6+8 (H-Series) 8+8 (HX-Series) |
| Max Cores / Threads | 16/16 | 8/8 | 14/14 | 14/20 | 14/20 | 14/20 |
| AI NPU | NPU5 (50 TOPS) | NPU4 (48 TOPS) | NPU3.5 (13 TOPS) | NPU3 (11 TOPS) | NPU2 (7 TOPS) | NPU2 (7 TOPS) |
| Planned Lineup | Core Ultra 300 | Core Ultra 200V | Core Ultra 200 | Core Ultra 100 | 14th/13th Gen | 12th Gen |
| GPU Architecture | Xe3-LPG (Battlemage) | Xe2-LPG (Battlemage) | Xe-LPG+ (Alchemist) | Xe-LPG (Alchemist) | Iris Xe (Gen 12) | Iris Xe (Gen 12) |
| Xe Cores (Max) | 12 Xe3 Cores | 8 Xe2 Cores | 8 Xe Cores | 8 Xe Cores | 96 EUs (768 Cores) | 96 EUs (768 Cores) |
| Memory Support | LPDDR5X-9600 | LPDDR5X-8533 | DDR5-5600 LPDDR5-7500 LPDDR5X-8533 | DDR5-5600 LPDDR5-7400 LPDDR5X - 7400+ | DDR5-5200 LPDDR5-5200 LPDDR5-6400 | DDR5-4800 LPDDR5-5200 LPDDR5X-4267 |
| Memory Capacity (Max) | 128 GB | 32 GB | 128 GB | 96 GB | 64 GB | 64 GB |
| Thunderbolt Support | TB5 | TB5 | TB5 | TB4 | TB4 | TB4 |
| WiFi Capability | WiFi 7 | WiFi 7 | WiFi 7 | WiFi 6E | WiFi 6E | WiFi 6E |
| TDP | 17-45W | 17-30W | TBD | 7W-45W | 15-55W | 15-55W |
| Launch | 2H 2025 | 2H 2024 | 2H 2024 | 2H 2023 | 1H 2023 | 1H 2022 |
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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