Intel's Panther Lake "Core Ultra Series 3" CPUs are now available in compact modules for Edge AI & Embedded platforms.
Intel Panther Lake CPUs With LPCAMM2 Featured On Compact Modules For Edge AI & Embedded Systems
During the Intel Tech Tour 2025, the blue team showcased its brand-new Panther Lake modules designed for Edge AI and Embedded systems. Now, a few weeks after launch, we are seeing the first of these Edge computing systems being announced.
Congatec has announced its new COM-HPC and COM Express modules with Intel Core Ultra Series 3 "Panther Lake" CPUs. The modules come in various passport-sized designs, featuring support for Intel Panther Lake-H CPUs with up to 16 cores, up to the X9 388H, and supporting TDPs of 25W. Memory and IO support vary per module.
In terms of memory, the modules come with some interesting configurations. Two Panther Lake modules support onboard LPDDR5X memory, with the conga-MC1000 getting up to 32 GB of 8533 MT/s memory, and the bigger "conga-HPC" getting up to 96 GB of LPDDR5X memory within the same speed limit. There are also two LPCAMM2 options, which feature up to 96 GB of LPDDR5X memory operating at 7466-8533 MT/s speeds. Lastly, there's a SO-DIMM option which offers two slots for up to 128 GB DDR5 memory at up to 7200 MT/s speeds.
As per Congatec, the Intel Panther Lake "Core Ultra Series 3" modules will offer up to 12 Xe3 cores, up to 120 TOPS of AI compute with a 50 TOPS NPU, can run 3-4 6K displays independently, & operate in temperatures of -40C to 85C. Each module comes with a 10+ year long-term availability cycle. As for power, while 25W is the baseline TDP, the modules can be configured between 15-65W. The three main sizes include:
- COM Express Type 10 (84 mm x 55 mm)
- COM-HPC mini (95 mm x 70 mm)
- COM Express compact (95 mm x 95 mm)
- COM-HPC Client Size A (95 mm x 120 mm)
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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