Intel's next-generation Arrow Lake "Core Ultra 200" & Panther Lake "Core Ultra 300" CPUs for laptops have been spotted in multiple leaks.
Intel Preps Arrow Lake & Panther Lake CPUs For Laptops, To Power Next-Gen Core Ultra 200 & Core Ultra 300 Series
The customs and shipping logger, nbd.ltd, has exposed several next-gen Intel Arrow Lake "Core Ultra 200" and Panther Lake "Core Ultra 300" CPUs which are designated for laptop platforms. It looks like the leak also sheds some light on the possible process nodes that will be used by these chips.
Starting with Intel's Arrow Lake lineup, the Core Ultra 200 CPU family will scale across several PC platforms including desktops and laptops. These chips will come in four primary segments, "S" for Desktops, "HX" for high-end laptops, "H" for Performance laptops, and "U" for low-power designs. While we have covered Intel's Arrow Lake-S Desktop CPUs in the past, this specific post will only focus on the laptop variants that have been leaked.
For Intel's high-end Arrow Lake-HX "Core Ultra 200" CPUs, the company is going with 8 P-Cores based on the Lion Cove architecture and 16 E-Cores based on the Skymont core architecture. The chips will be very similar to the desktop SKUs and will feature similar die configurations as we've seen in the past with HX series. The Arrow Lake-H CPUs will come in the standard 14-core configs with up to 6 P-Cores and 8 E-Cores which is also similar to the existing Raptor Lake-P/H SKUs.
The low-power Arrow Lake-U chips will come with a 10-core config with up to 2 P-Cores and 8 E-Cores.
Following are the full range of chips that have leaked out:
- Arrow Lake-S 24-Core 8+16 (LGA 1851) - 3.6 GHz / 36 MB L3 Cache
- Arrow Lake-S 14 -Core 6+8 (LGA 1851) - 2.8 GHz / 24 MB L3 Cache
- Arrow Lake-S 6-Core 6+0 (LGA 1851) - 2.8 GHz / 18 MB L3 Cache
- Arrow Lake-HX 16-Core 8+8 (FCBGA) - 2.9 GHz / 30 MB L3 Cache
- Arrow Lake-HX 14-Core 6+8 (FCBGA) - 3.0 GHz / 24 MB L3 Cache
- Arrow Lake-H 14-Core 6+8 (FCBGA) - TBD
- Arrow Lake-U 10-Core 2+8 (FCBGA) - TBD
The Arrow Lake-H CPUs will pack GT2 tier graphics based on the Arc Alchemist Xe-LPG+ graphics architecture & Arrow Lake-HX CPUs will retain the existing Arc Xe-LPG iGPU, similar to the desktop variants. The Arrow Lake-U CPUs will be packing the Arc Xe-LPG+ iGPU too but in GT1 designs only. The more interesting part about this leak is that it mentions the N3B process node for Arrow Lake-H which means that Intel is still leveraging TSMC's process node for its next high-end laptop chips. According to @miktdt, the compute tile will be using the N3B process node while the iGPU tile is going to be based on the N4 process node.
Besides Intel's Arrow Lake, there are also new shipping logs for the Intel Panther Lake "Core Ultra 300" CPUs in UH, UPH, and P flavors. These chips are currently being evaluated on the reference platforms and Intel recently said that it had achieved "Power On" with PTL parts on the 18A node.
Furthermore, it looks like Intel is going to incorporate LPDDR5X on-package memory again with Panther Lake-U low-power SKUs for thin and light platforms. Intel has already confirmed that its Panther Lake lineup will scale up what Lunar Lake had to offer and will offer more flexible DRAM configurations so you won't be limited to just 16 GB or 32 GB LPDDR5X capacities. A more recent Panther Lake leak also confirmed the "H" SKUs with 12 Xe cores based on the Celestial graphics IP.
A more recent Dell leak revealed that the Intel Arrow Lake-H/P/U CPUs will target an early 2025 release, probably by CES 2025 while Panther Lake CPUs will be targeting a release in early 2026.
Intel Mobility CPU Lineup:
| CPU Family | Panther Lake | Lunar Lake | Arrow Lake | Meteor Lake | Raptor Lake | Alder Lake |
|---|---|---|---|---|---|---|
| Process Node (CPU Tile) | Intel 18A | TSMC N3B | TSMC N3B | Intel 4 | Intel 7 | Intel 7 |
| Process Node (GPU Tile) | TSMC N3E / Intel 3 | TSMC N3B | TSMC 5nm | TSMC 5nm | Intel 7 | Intel 7 |
| CPU Architecture | Hybrid | Hybrid (Dual-Core) | Hybrid (Triple-Core) | Hybrid (Triple-Core) | Hybrid (Dual-Core) | Hybrid (Dual-Core) |
| P-Core Architecture | Cougar Cove | Lion Cove | Lion Cove | Redwood Cove | Raptor Cove | Golden Cove |
| E-Core Architecture | Darkmont | N/A | Skymont | Crestmont | Gracemont | Gracemont |
| LP E-Core Architecture (SOC) | Darkmont | Skymont | Crestmont | Crestmont | N/A | N/A |
| Top Configuration (Compute Tile) | 4+8 (H-Series) | 4+4 (MX Series) | 6+8 (H-Series) 2+8 (U-Series) | 6+8 (H-Series) 2+8 (U-Series) | 6+8 (H-Series) 8+16 (HX-Series) | 6+8 (H-Series) 8+8 (HX-Series) |
| Max Cores / Threads | 16/16 | 8/8 | 14/14 | 14/20 | 14/20 | 14/20 |
| AI NPU | NPU5 (50 TOPS) | NPU4 (48 TOPS) | NPU3.5 (13 TOPS) | NPU3 (11 TOPS) | NPU2 (7 TOPS) | NPU2 (7 TOPS) |
| Planned Lineup | Core Ultra 300 | Core Ultra 200V | Core Ultra 200 | Core Ultra 100 | 14th/13th Gen | 12th Gen |
| GPU Architecture | Xe3-LPG (Battlemage) | Xe2-LPG (Battlemage) | Xe-LPG+ (Alchemist) | Xe-LPG (Alchemist) | Iris Xe (Gen 12) | Iris Xe (Gen 12) |
| Xe Cores (Max) | 12 Xe3 Cores | 8 Xe2 Cores | 8 Xe Cores | 8 Xe Cores | 96 EUs (768 Cores) | 96 EUs (768 Cores) |
| Memory Support | LPDDR5X-9600 | LPDDR5X-8533 | DDR5-5600 LPDDR5-7500 LPDDR5X-8533 | DDR5-5600 LPDDR5-7400 LPDDR5X - 7400+ | DDR5-5200 LPDDR5-5200 LPDDR5-6400 | DDR5-4800 LPDDR5-5200 LPDDR5X-4267 |
| Memory Capacity (Max) | 128 GB | 32 GB | 128 GB | 96 GB | 64 GB | 64 GB |
| Thunderbolt Support | TB5 | TB5 | TB5 | TB4 | TB4 | TB4 |
| WiFi Capability | WiFi 7 | WiFi 7 | WiFi 7 | WiFi 6E | WiFi 6E | WiFi 6E |
| TDP | 17-45W | 17-30W | TBD | 7W-45W | 15-55W | 15-55W |
| Launch | 2H 2025 | 2H 2024 | 2H 2024 | 2H 2023 | 1H 2023 | 1H 2022 |
News Sources: @harukaze5719 #1 , #2
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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