The Kirin 9000S is considered by the industry to be a semiconductor miracle, as Huawei had to deal with overwhelming odds, thanks to the U.S. sanctions, just to mass produce a chipset last year. Now that the former Chinese giant has successfully displayed its chip-making prowess, the next step is to switch to advanced manufacturing processes to ensure that it maintains some pace with the competition. Unfortunately, in its reported quest to acquire TSMC’s 3.5nm chip shipments, a Huawei executive has expressed disappointment that the attempt has been unsuccessful due to the same trade ban.
With the 7nm technology available, Huawei executive says that the company needs to find more efficient ways to take advantage of it
Speaking at the Mobile Computility Network Conference in Suzhou, China, Business Korea reports that Huawei’s Cloud Services CEO, Zhang Ping’an, showed concern over the technology firm’s inability to secure 3.5nm chip shipments from TSMC. For those who do not know, various companies have been barred from dealing with any entity of Chinese origin. ASML, the world’s leader in advanced EUV machinery for mass producing wafers on cutting-edge lithography, cannot deal with the likes of Huawei.
“Taiwan’s TSMC is increasing its supply of 3.5nm semiconductors. However, under U.S. sanctions, China has no way to secure these products. It’s fortunate that we've managed to address the 7nm issue. The reality is that we can't introduce advanced manufacturing equipment due to U.S. sanctions, and we need to find ways to effectively utilize the 7nm semiconductors.”
The executive’s statement likely surprised many, especially when Huawei and SMIC have been working behind closed doors to develop 5nm technology for future Kirin chipsets. In fact, an earlier report stated that SMIC has successfully developed the 5nm node without any EUV equipment and has set up an internal research team to pursue the development of the 3nm process.
Naturally, it will be an arduous journey and one that will require billions of dollars for research, which could be why Huawei attempted to secure a short-term deal with TSMC. Unfortunately, the U.S. is laser-focused on stifling China’s progress in the semiconductor race, which is why it will keep Huawei and other companies at bay when dealing with any manufacturer of next-generation wafers.
News Source: Business Korea
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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