Google’s previous Tensor chipsets powering the company’s Pixel lineup of smartphones and, just recently, a tablet, are, in one way or another, based on Samsung’s previous Exynos SoC launches. The Tensor G3’s unique 9-core CPU cluster was likely based on the Korean giant’s unreleased Exynos 2300, so it would be completely fine to assume that the upcoming Tensor G4 would have some relation with the Exynos 2400. Unfortunately, the specification differences do not give us confidence in this claim, even though one tipster believes it.
Tipster realizes his error with his claim; makes an updated statement that the Tensor G4 will be based on Google’s and ARM’s design
For those that do not know, Samsung’s Exynos 2400 features a 10-core CPU cluster, whereas a Geekbench 5 leak revealed that the Tensor G4 is an 8-core CPU part, with its overall configuration sporting one less core than what the Tensor G3 was touting. Regardless, @OreXda believes that Google’s upcoming SoC designed for the Pixel 9 and Pixel 9 Pro is based on the Exynos 2400 and shares a few specifications too, but probably failed to notice the differences between each silicon.
Even the GPUs of the Tensor G4 and Exynos 2400 are entirely different, with the latter featuring an Xclipse 940 graphics processor that is based on AMD’s RDNA3 architecture, while the Tensor is shown to house ARM’s Immortalis-G715, which remains unchanged from the Tensor G3. Thankfully, the tipster realized the error of his claims and responded on the thread that the Tensor G4 could be a semi-custom SoC, with Google taking advantage of ARM’s existing CPU and GPU designs.
Tensor G4 : Based on Exynos 2400#CPU
- 1 x Cortex-X4 @ 3.1 GHz
- 3 x Cortex-A720 @ 2.6GHz
- 4 x Cortex-A520 @ 1.95GHz#GPU
- Mali-G715 pic.twitter.com/Vq9ukL5reD— Connor/코너/コナー (@OreXda) February 9, 2024
What @OreXda may have meant when he said that the Tensor G4 is based on the Exynos 2400 is that it utilizes various fabrication and packaging technologies that Samsung introduced this year. This includes the more efficient 4LPP+ process, along with ‘Fan-out Wafer Level Packaging’ (FOWLP), which lowers heat resistance, allowing a smartphone silicon to maintain its temperatures and obtain high multi-core scores. We also reported earlier that the Tensor G4 would be a minor upgrade over its predecessor.
This means that until Google switches its foundry partner to TSMC, which is not slated to happen until the arrival of the Tensor G5 in 2025, we should not expect the Pixel 9 or Pixel 9 Pro to pose any meaningful threat to the competition in raw performance. Google can tackle the market in other categories, such as on-device AI capabilities and a new camera array, but in single-threaded and multi-threaded workloads, Google might be behind the pack once again.
News Source: @OreXda
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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