As Samsung prepares for its Galaxy Unpacked 2024 event that will be held on January 17, the company is also working with several service center partners around the world, likely supplying them with various parts to help honor customer warranty in case any Galaxy S24 component starts to fail on them. One Slovenian repair center shared some high-resolution images of the USB-C ports belonging to the Korean giant’s upcoming flagship family, along with an easily visible SIM card tray.
Spare parts do not reveal anything noteworthy other than the fact that the Galaxy S24 will not support eSIM at launch
The spare parts were shared by Mobistekla, who provided zoomed images to GSMArena of various parts belonging to the Galaxy S24, Galaxy S24 Plus, and Galaxy S24 Ultra. The ones that have not been pictured here include a few flex and ribbon cables for the power and volume buttons, but the more interesting images were the USB-C ports present on the PCB.
These spare parts indicate that Samsung will be using various components for each of the three Galaxy S24 models, which would have made things easier for Samsung’s supply chain and third-party repair personnel. We also see red rubber gaskets covering the USB-C port, which is used to prevent water from seeping inside and ruining the expensive flagships.
In case you have not noticed, there are also SIM card trays located right next to the USB-C ports, and this is the only evidence you need to see to inform you that the Galaxy S24 will not support eSIM, though there might be a secondary option located somewhere on the logic board.
The back of the PCB features two connectors, which no doubt connect to the rest of the board. Overall, nothing was too noteworthy about these components, but hopefully, we will find something interesting when the first teardown videos arrive, so stay tuned.
About the author: Omar Sohail is a reporter and analyst for Wccftech's mobile section, specializing in the technology and business of the mobile industry. His expertise lies in the intricate hardware supply chain, covering developments in semiconductor manufacturing, chip lithography, and camera sensor technology.
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