DDR6 memory development is in full swing with major DRAM makers including Samsung, SK Hynix & Micron all racing towards completion to meet growing AI demands.
The Next Chapter of DRAM Just Kicked off With Samsung, SK Hynix & Micron All In The Race To Complete DDR6 Development & Deployment By 2028-2029
As AI continues to demand speedier and higher-capacity memory, DRAM makers are now initiating the development plan for next-gen standards.
Last year, JEDEC announced the LPDDR6 standard, bringing improved performance and efficiency versus LPDDR5. LPDDR memory has already become the favorite of the AI industry, offering faster speeds, high-capacities, while operating efficiently. LPDDR's power efficiency characteristics make it great for AI data-centers, and we have seen SOCAMM2 with LPDDR5/X becoming the standard for AI servers.
Now, the top three memory makers, Samsung, SK Hynix, and Micron, are adding momentum towards the development of DDR6 memory. The new memory technology is expected to further uplift the capabilities of DDR5 standards, offering improvements across the board. As per The Elec, substrate manufacturers are being requested to advance the development of DDR6.
"Memory companies and substrate manufacturers typically proceed with joint development more than two years before product launch," said an official from the substrate industry. "Initial development of DDR6 has recently begun."
via The Elec
Although DDR6 won't reach commercialization for a few years, substrate manufacturers initiate joint development on new projects two years in advance. With the initial development already commenced, memory makers are now in a race to be the first to roll out their respective DDR6 products. Neither has released or showcased any DDR6 modules yet, but given the increased interest in new memory standards, all three are hoping their next-gen designs become the go-to solution for upcoming AI data centers.
As we have seen with DDR5, AI firms don't restrict themselves to a single DRAM supplier, as shortages are so intense that even having multiple DRAM suppliers is not enough to meet their requirements. Samsung and Micron have already stated that memory supply will remain constrained for several years, with 2027 being worse than 2026.
Right now, DDR5 accounts for over 80% of the server memory market share and is expected to reach 90% within this year.
DDR6 Brings The Next Memory Boost In Data Center & Consumer Segments
As for the technology itself, DDR6 is expected to deliver speeds in the range of 8.4 Gbps, and go all the way up to 17.6 Gbps as the process matures. The memory will also offer higher capacities & retain a low-power operation with less than 1.0V expected for LPDDR6 standards.
Just recently, JEDEC previewed its next-generation LPDDR6 SOCAMM2 memory featuring 512 GB capacities in a compact and power-efficient design. DDR6 commercialization is expected between 2028 and 2029 for AI datacenters, and consumers will get a taste of the next-gen memory a year or two after the demands of datacenters are met.
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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