AURAS is showing off its 1000W TDP cooler designed for next-generation GPUs as the demand for power rises with higher performance.
AURAS, A Leading Cooler Maker, Believes Next-Gen GPUs Will Come With a 1000W TDP & Has Designed A Dual 360mm AIO For Them
Last year, AURAS displayed its air-cooled solutions for existing and upcoming GPUs. The cooler was designed for 600W GPUs and had the 5090/Next-Module label. This year, the company has revised its expectations for future GPUs and is aiming for even higher TDP cooling solutions.
Displayed at its Computex booth, AURAS showcased its "Advanced VGA Solution," which is a massive AIO design featuring a 1000W Thermal Solution. The 1000W cooler features a dual high-flow pump design & twin 360mm high-density radiators. The waterblock makes use of a high-density pure copper micro-fins channel, and the solution will cover the entire PCB of future graphics cards. The shroud features an ARGB aesthetic and a mirror finish, which looks great.
While this is just a conceptual design, AURAS is a leading cooling partner for several graphics card makers, and we could very well see these designs on NVIDIA's next-gen RTX GPUs based on Rubin architectures. It will be hard to accommodate such a massive cooler within standard cases, & a large chassis will be required to house this monster.
AMD SP8 & SP7 EPYC and Intel Next-Gen Xeon Liquid Coldplates
Besides VGAs, AURAS also unveiled its cooling solutions for AMD's upcoming SP8 and SP7 platforms that will feature support for Venice and Verano CPUs based on the Zen 6 core architecture. These solutions are all liquid-cooled with large cold plates to accommodate the next-gen EPYC family
The company also showed off its next-gen CPU AIO cooling module for Intel's next-gen datacenter Xeon CPUs, such as Diamond Rapids, which lands next year. The designs are optimized around 1U & 2U racks, supporting a single or dual CPU configuration.
And lastly, the company has new waterblock designs for next-gen motherboards based on the AMD AM5 and next-generation Intel sockets.
The waterblock covers the MOS area and offers a copper base for higher heat conductivity. The cooling manufacturer offers various designs, with the one showcased using a transparent acrylic design and LED lighting. It uses universal G1/4" threads and comes with high-thermal conductivity pads.
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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