Users can now mix and match DDR5 memory on the latest Intel platform to achieve better tuning without worrying about compatibility.
ASUS Rolls Out BIOS 3002 and 3103 to Mix and Match Memory, Allowing Users to Optimize Different Spec "Green" Modules on Intel Z890 and B860
At a time when DDR5 RAM prices are at an all-time high, many are looking at the JEDEC industry standard RAM modules, which typically bring lower clocks out of the box compared to Intel XMP or AMD EXPO-enabled memory modules. These adhere to strict standards and operate at a particular frequency, timing, and voltage. It's well-known that, unlike XMP and EXPO-enabled memories, most JEDEC industry RAM modules don't have any heatsinks due to their strict standards, which is why they are often referred to as "green" RAM. However, with manual overclocking, it's possible to bump their clock speeds above the JEDEC ratings.
However, it's crucial to utilize the same type of memory modules to get consistent performance and proper compatibility. When you try to mix and match different JEDEC industry standard RAM modules, featuring different specifications, compatibility issues arise. To fix the same, ASUS has rolled out the latest UEFI BIOS versions 3002 and 3103 for its Intel Z890 and B860 chipset motherboards. We don't know if ASUS is working on AMD platforms at the moment, but as of now, only the Intel LGA 1851 platform seems to enjoy the new perks.
ASUS AEMP (ASUS Enhanced Memory Profile) has brought new changes to the Intel platform, allowing mixing and matching different JEDEC industry standard RAM modules. ASUS says that with AEMP II and III, users can now mix different green modules without XMP profiles on a single motherboard and get optimized settings automatically. While AEMP II is for U-DIMM, AEMP III will work for CU-DIMM DDR5 memory modules.
All users have to do is head to the Extreme Tweaker > AI Overclocker Tuner and select AEMP II or III based on the type of DIMM DDR5 memory modules installed. Remember that users cannot mix U-DIMM and CU-DIMM memory types, but can mix different spec U-DIMM or CU-DIMMs. The optimization process takes around 5 minutes, and AEMP II/III will automatically configure the settings for the RAM modules. ASUS has demonstrated this by mixing and matching various JEDEC industry standard DDR5 modules on the ROG Maximus Z890 Extreme.
The platform utilized the Intel Core Ultra 7 265K and had four memory modules from Samsung, SK Hynix, and SK Hynix, rated at either 4800 MT/s or 5600 MT/s. Each memory module brought a different capacity, including 8 GB, 12 GB, 16 GB, and 24 GB. After selecting AEMP II/III, the system analyzed the configuration that takes several parameters into account, such as motherboard, CPU, and RAM specs, to determine the frequency, timings, and voltages. After the processor was complete, the DRAM transfer speed was set to 5200 MT/s, which was higher than the 4800 MT/s of the Samsung 8 GB module.
ASUS also tested the configuration for stability, and the setup passed with flying colors. Apart from AEMP II and AEMP III optimizations, ASUS also launched DIMM Fit and DIMM Fit Pro for optimizing the Intel XMP DIMMs to reach better stability and compatibility on Intel platforms, especially in mixed DIMM configurations. Overall, ASUS has done a great job with memory compatibility on the Intel LGA 1851 platform, but we would love to see such support on the AMD AM5 platform as well.
News Source: Reddit
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