Several chipset makers will shift to TSMC’s 2nm technology in 2026, and to help ease this transition, the semiconductor behemoth reportedly intends to commence mass production in the fourth quarter of 2025. Repeating history, Apple is said to be the manufacturer’s largest customer for these wafers and has secured nearly half of the initial capacity, with the majority of the shipments likely to be used for the company’s A20 and A20 Pro chipsets that will be found in the iPhone 18 series. TSMC was earlier reported to have started accepting orders on its next-generation lithography from April 1, with the primary goal of hitting 50,000 monthly wafers by the end of the year.
Production goal for 2026 stands at a whopping 100,000 wafers, with TSMC’s Arizona plant helping the company reach 200,000 2nm units in 2028
The latest information published on DigiTimes states that TSMC is estimated to reach a monthly production capacity of 45,000 to 50,000 wafers, with each unit expected to set customers back by a mammoth $30,000. Regardless of this price increase, the report states that Apple and Qualcomm will be two of TSMC’s biggest customers, with other clients, such as AMD, MediaTek, Broadcom, and more, waiting in line to get their hands on the cutting-edge technology. During the trial production phase that kicked off earlier this year, TSMC was reported to have achieved yields of 60 percent.
While the current figure was not mentioned in the report, it will undoubtedly be higher, considering that TSMC has not just made progress on improving those yields, but has also opened up production at different facilities in Taiwan. Even with these achievements, the majority of the 2nm wafer production will happen at TSMC’s Baoshan and Kaohsiung plants, with its 3nm and 4nm nodes fully booked throughout 2026. By the end of next year, the semiconductor giant is estimated to hit 100,000 monthly wafers, with its Arizona fabrication facility in the U.S. expected to prop up that number to 200,000 units by 2028.
We believe that some of TSMC’s customers will commence tape-out of their 2nm chipsets by the fourth quarter, with MediaTek publicly announcing these goals to achieve a lead against the competition. Unfortunately, the drawback is that the increased prices of TSMC’s wafers will force its customers to pass down those cost bumps to their products, which could adversely affect demand, but that will be a debate for another time.
News Source: DigiTimes
Follow Wccftech on Google to get more of our news coverage in your feeds.
